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Epoxy Technology EPO-TEK® TZ101 Thermally Conductive Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Thermally Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® TZ101 Thermally Conductive Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® TZ101 is a single component, electrically insulating, thermally conductive epoxy adhesive designed for heatsinking of semiconductors, hybrids, electronics, and optics. Also available in a frozen syringe.Advantages & Application Notes: Suggested Applications:Electronics:Bonding to Kapton flex PCB circuits.Adhesive for LCP packaging.Semiconductor: large IC die attach > 500 mil x 500 mil Si chips.Can be used as an underfill for flip chip mounted ICs, BGAs, and SMDs.Opto-electronics:Heat sinking laser diode chips in ceramic, hybrid or TO-can packaging.Bonding to thermally enhanced substrates such as aluminum nitride, Cu/W or Cu-plated BeO.White color after cure makes it attractive for LED, opto-coupler and x-ray scintillator circuits.Excellent damp heat resistance, via 85°C/85%RH.Excellent combination of stress relief and robustness.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.37 g/cc
1.37 g/cc
Particle Size <= 20 µm
<= 20 µm
Viscosity 24000 - 30000 cP

@Temperature 23.0 °C
24000 - 30000 cP

@Temperature 73.4 °F
10 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 84
84
Tensile Modulus 3.54 GPa
514 ksi
Storage
Shear Strength 11.90 MPa
1726 psi
Lap
>= 23.4 MPa
>= 3400 psi
Die
Thermal Properties Metric English Comments
CTE, linear 32.0 µm/m-°C
17.8 µin/in-°F
Below Tg
173 µm/m-°C
96.1 µin/in-°F
Above Tg
Thermal Conductivity 0.930 W/m-K
6.45 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 175 °C
347 °F
Continuous
275 °C
527 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 40.0 °C
>= 104 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 40—200°C @ 20°C/Min
Decomposition Temperature 355 °C
671 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity >= 2.00e+13 ohm-cm
>= 2.00e+13 ohm-cm
Dielectric Constant 3.8

@Frequency 1000 Hz
3.8

@Frequency 1000 Hz
Dissipation Factor 0.0040

@Frequency 1000 Hz
0.0040

@Frequency 1000 Hz
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 188 ppm
188 ppm
Ionic Impurities - K (Potassium) 8.0 ppm
8.0 ppm
Ionic Impurities - Cl (Chloride) 240 ppm
240 ppm
Processing Properties Metric English Comments
Cure Time 60.0 min

@Temperature 150 °C
1.00 hour

@Temperature 302 °F
Minimum Bond Line
Pot Life 40320 min
40320 min
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Descriptive Properties Value Comments
Color White
Consistency Smooth thixotropic paste
Ionic Impurities NH4 19 ppm
Number of Components Single
Thixotropic Index 3.7
Weight Loss 0.4%
200°C
0.9%
250°C
1.86%
300°C
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