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Epoxy Technology EPO-TEK® H54 High Temperature Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H54 High Temperature Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® H54 is a two component, high Tg, electrically and thermally insulating epoxy adhesive for general bonding and high temperature packaging in medical, hybrid, and optical industries.Advantages & Application Notes: Thixotropic nature provides a non-sag adhesive, with wet green strength prior to cure.Color change from tan to amber upon successful cure.Versatile adhesive to most plastics, ceramics, metals, and glass.Suggested Applications:PCB; Staking SMD devices to the PCB for double-sided assembly.Bonding of ferrites for power-devices.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.02 g/cc
1.02 g/cc
Part A
1.12 g/cc
1.12 g/cc
Part B
Particle Size <= 20 µm
<= 20 µm
Viscosity 9000 - 15000 cP

@Temperature 23.0 °C
9000 - 15000 cP

@Temperature 73.4 °F
20 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Tensile Modulus 3.8550 GPa
559.12 ksi
Storage
Shear Strength 13.47 MPa
1953 psi
Lap
>= 35.2 MPa
>= 5100 psi
Die
Thermal Properties Metric English Comments
CTE, linear 43.0 µm/m-°C
23.9 µin/in-°F
Below Tg
231 µm/m-°C
128 µin/in-°F
Above Tg
Maximum Service Temperature, Air 225 °C
437 °F
Continuous
325 °C
617 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 90.0 °C
>= 194 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 399 °C
750 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity >= 4.00e+12 ohm-cm
>= 4.00e+12 ohm-cm
Dielectric Constant 3.21

@Frequency 1000 Hz
3.21

@Frequency 1000 Hz
Dissipation Factor 0.0030

@Frequency 1000 Hz
0.0030

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 1.00 min

@Temperature 150 °C
0.0167 hour

@Temperature 302 °F
minimum
5.00 min

@Temperature 120 °C
0.0833 hour

@Temperature 248 °F
minimum
10.0 min

@Temperature 100 °C
0.167 hour

@Temperature 212 °F
minimum
Pot Life 180 min
180 min
Shelf Life 12.0 Month

@Temperature 23.0 °C
12.0 Month

@Temperature 73.4 °F
Descriptive Properties Value Comments
Color Amber
Part B
Tan
Part A
Consistency Smooth Thixotropic paste
Mix Ratio By Weight 10:1
Number of Components Two
Weight Loss 0.02%
200°C
0.45%
250°C
1.46%
300°C
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