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Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H20E-LV Electrically Conductive, Silver Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® H20E-LV is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is a low viscosity version of EPO-TEK® H20E, semiconductor die-attach epoxy.Advantages & Application Notes: Especially recommended for use in high speed chip bonding systems where very fast cures are desired. Suggested for JEDEC Level III and II for plastic IC packaging. Capable of resisting TC wire bonding temperatures in the range of 300°C to 400°C. Ease of use: apply by dispensing, screen printing, die-stamping or by hand. Especially suited for high power devices and high current flow. High power LEDs. Opto-electronic packaging material: LED, LCDs and fiber components. Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.93 g/cc
1.93 g/cc
Part A
3.07 g/cc
3.07 g/cc
Part B
Particle Size <= 45 µm
<= 45 µm
Viscosity 1800 - 2800 cP

@Temperature 23.0 °C
1800 - 2800 cP

@Temperature 73.4 °F
100 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 86
86
Tensile Modulus 4.42 GPa
640 ksi
Storage
Shear Strength 10.3 MPa
1500 psi
Lap
>= 11.7 MPa
>= 1700 psi
Die
Thermal Properties Metric English Comments
CTE, linear 26.0 µm/m-°C
14.4 µin/in-°F
Below Tg
93.0 µm/m-°C
51.7 µin/in-°F
Above Tg
Thermal Conductivity 2.50 W/m-K
17.4 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Continuous
300 °C
572 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 80.0 °C
>= 176 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature 400 °C
752 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.00040 ohm-cm
<= 0.00040 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 98 ppm
98 ppm
Ionic Impurities - K (Potassium) 25 ppm
25 ppm
Ionic Impurities - Cl (Chloride) 102 ppm
102 ppm
Processing Properties Metric English Comments
Cure Time 0.750 min

@Temperature 175 °C
0.0125 hour

@Temperature 347 °F
Minimum Bond Line
5.00 min

@Temperature 150 °C
0.0833 hour

@Temperature 302 °F
Minimum Bond Line
15.0 min

@Temperature 120 °C
0.250 hour

@Temperature 248 °F
Minimum Bond Line
Pot Life 4320 min
4320 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Silver
Part A
Silver
Part B
Consistency Smooth flowing paste
Ionic Impurities NH4 320 ppm
Mix Ratio By Weight 1:1
Number of Components Two
Thixotropic Index 3.43
Weight Loss 2.34%
300°C
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