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Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, Electrically Conductive
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® H20-HC Electrically Conductive Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. Also available in a single component frozen syringe. This is an increased thermal conductivity version of EPOTEK® H20E.Advantages & Application Notes: Processing info - it can be applied by many dispensing, stamping and screen printing techniques.Dispensing: compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a singlecomponent fashion.Screen Printing: best using >200 metal mesh with polymer squeegee blade with 80D hardness.Stamping: small dots 6 mil in diameter can be realized.Misc /Other notes:Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hot plate, IR, convection, or inductor coil.Suggested applications:LED – HB LED industry; light engines for HD-TV; LCD color projection.Solar, die-attach epoxy for CPV chips onto ceramic carriers; thermal epoxy for ceramic to aL finned heat sink.Information Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 3.44 g/cc
3.44 g/cc
Part A
4.39 g/cc
4.39 g/cc
Part B
Particle Size <= 45 µm
<= 45 µm
Viscosity 3500 - 6000 cP

@Temperature 23.0 °C
3500 - 6000 cP

@Temperature 73.4 °F
50 rpm
Mechanical Properties Metric English Comments
Hardness, Shore A 93
93
Tensile Modulus 3.9490 GPa
572.75 ksi
Storage
Shear Strength 11.7 MPa
1700 psi
Lap
Thermal Properties Metric English Comments
CTE, linear 53.0 µm/m-°C
29.4 µin/in-°F
Below Tg
80.0 µm/m-°C
44.4 µin/in-°F
Above Tg
Thermal Conductivity 10.9 W/m-K

@Temperature 150 °C,
Time 3600 sec
75.6 BTU-in/hr-ft²-°F

@Temperature 302 °F,
Time 1.00 hour
23.0 W/m-K

@Temperature 150 °C,
Time 3600 sec
160 BTU-in/hr-ft²-°F

@Temperature 302 °F,
Time 1.00 hour
+ 200°C/1Hr
Maximum Service Temperature, Air 175 °C
347 °F
Continuous
275 °C
527 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Decomposition Temperature 372 °C
702 °F
Degradation Temperature
Electrical Properties Metric English Comments
Volume Resistivity <= 0.000080 ohm-cm
<= 0.000080 ohm-cm
Chemical Properties Metric English Comments
Ionic Impurities - Na (Sodium) 24 ppm
24 ppm
Ionic Impurities - K (Potassium) >= 17 ppm
>= 17 ppm
Ionic Impurities - Cl (Chloride) 34 ppm
34 ppm
Processing Properties Metric English Comments
Cure Time 30.0 min

@Temperature 175 °C
0.500 hour

@Temperature 347 °F
Minimum Bond Line
Pot Life 3600 min
3600 min
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Silver
Part A
Silver
Part B
Consistency Smooth thixotropic paste
Ionic Impurities NH4 45 ppm
Mix Ratio By Weight 1:1
Number of Components Two
Thixotropic Index 3.48
Weight Loss 0.14%
200°C
0.42%
250°C
1.05%
300°C
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