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Epoxy Technology EPO-TEK® ED1021 Epoxy
| Category | Polymer , Thermoset , Epoxy |
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Epoxy Technology EPO-TEK® ED1021 Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Unique features include its ability to achieve high thermal conductivity values at low cure temperatures and a very shiny silver appearance which enhances overall LED brightness. Other benefits include long pot-life, low viscosity and high thixotropy making it ideal for wafer level stamping as well as syringe dispensing.Information Provided by Epoxy Technology
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 2.80 g/cc | 2.80 g/cc | |
| Particle Size | <= 20 µm | <= 20 µm | |
| Viscosity | 1819 cP @Temperature 23.0 °C |
1819 cP @Temperature 73.4 °F |
100 rpm |
| 8782 cP @Temperature 23.0 °C |
8782 cP @Temperature 73.4 °F |
10 rpm | |
| 37282 cP @Temperature 23.0 °C |
37282 cP @Temperature 73.4 °F |
1 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 82 | 82 | |
| Tensile Modulus | 0.1782 GPa | 25.85 ksi | Storage |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 5.20 µm/m-°C | 2.89 µin/in-°F | Below Tg |
| 184 µm/m-°C | 102 µin/in-°F | Above Tg | |
| Thermal Conductivity | 3.30 W/m-K | 22.9 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 200 °C | 392 °F | Continuous |
| 300 °C | 572 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| -55.0 °C | -67.0 °F | Intermittent | |
| Glass Transition Temp, Tg | >= 48.0 °C | >= 118 °F | |
| Decomposition Temperature | 403 °C | 757 °F | Degradation Temperature |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.00020 ohm-cm | <= 0.00020 ohm-cm |
| Chemical Properties | Metric | English | Comments |
|---|---|---|---|
| Ionic Impurities - Na (Sodium) | 3.0 ppm | 3.0 ppm | |
| Ionic Impurities - K (Potassium) | 1.0 ppm | 1.0 ppm | |
| Ionic Impurities - Cl (Chloride) | <= 10 ppm | <= 10 ppm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 30.0 min @Temperature 150 °C |
0.500 hour @Temperature 302 °F |
|
| Pot Life | 129600 min | 129600 min | |
| Shelf Life | 12.0 Month @Temperature -40.0 °C |
12.0 Month @Temperature -40.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Silver | |
| Consistency | Smooth thixotropic paste | |
| Die Shear | 12 kg | After 1000hrs 85°C/85% RH |
| 12.4 kg | Initial | |
| Ionic Impurities NH4 | 9 ppm | |
| Number of Components | Single | |
| Thixotropic Index | 4.2 | |
| Weight Loss | 0.35% | 200°C |
| 0.41% | 250°C | |
| 0.56% | 300°C |
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