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Epoxy Technology EPO-TEK® 353ND High Temperature Epoxy

Category Polymer , Thermoset , Epoxy , Epoxy, High Temperature
Manufacturer Epoxy Technology
Trade Name EPO-TEK®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Epoxy Technology EPO-TEK® 353ND High Temperature Epoxy.pdf
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Material Notes:
Product Description: EPO-TEK® 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK® brand products, and is known throughout the world for its performance and reliability. Also available in a single component frozen syringe.Advantages & Application Notes: Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.Passes NASA low outgassing standard ASTM E595 with proper cureSemiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor devices, resisting high temperature packagingDown-Hole petrochemical fiber optic sensors, resisting >200°C field conditionsFiber optic adhesive designed to meet Telecordia 1221 - suggested applications:Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arraysMedical suggested applications:Potting fiber optic bundles into ferrules for light guides and endoscopes; capable of resisting several sterilization techniques including ETO, gamma, ION beam, H202 plasma, and >200 autoclave steam cycles; excellent adhesion to surfaces including SST, diamond, titanium, brass, ceramics, glass and most plastics.Adhesive for catheter devices including stents and guide wires.Certified to USP Class VI and ISO 10993 biocompatibility standards for medical implants.Compatible with CIDEX® OPA sterilization.Electronics Assembly suggested applications:Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devicesImpregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.Structural grade epoxy found in hard-disk drive devices; bonding of SST metals, kapton, and magnetsInformation Provided by Epoxy Technology
Physical Properties Metric English Comments
Specific Gravity 1.02 g/cc
1.02 g/cc
Part B
1.18 g/cc
1.18 g/cc
Frozen Syringe
1.20 g/cc
1.20 g/cc
Part A
Viscosity 3000 - 5000 cP

@Temperature 23.0 °C
3000 - 5000 cP

@Temperature 73.4 °F
50 rpm
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
Tensile Modulus 3.56 GPa
517 ksi
Storage
Shear Strength >= 13.8 MPa
>= 2000 psi
Lap
>= 35.2 MPa
>= 5100 psi
Die
Thermal Properties Metric English Comments
CTE, linear 54.0 µm/m-°C
30.0 µin/in-°F
Below Tg
206 µm/m-°C
114 µin/in-°F
Above Tg
Maximum Service Temperature, Air 250 °C
482 °F
Continuous
350 °C
662 °F
Intermittent
Minimum Service Temperature, Air -55.0 °C
-67.0 °F
Continuous
-55.0 °C
-67.0 °F
Intermittent
Glass Transition Temp, Tg >= 90.0 °C
>= 194 °F
Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
Decomposition Temperature 412 °C
774 °F
Degradation Temperature
Optical Properties Metric English Comments
Refractive Index 1.5694

@Wavelength 589 nm
1.5694

@Wavelength 589 nm
uncured
Transmission, Visible <= 80 %

@Wavelength 550 nm
<= 80 %

@Wavelength 550 nm
Spectral
<= 95 %

@Wavelength 800 - 1000 nm
<= 95 %

@Wavelength 800 - 1000 nm
Spectral
<= 98 %

@Wavelength 1100 - 1600 nm
<= 98 %

@Wavelength 1100 - 1600 nm
Spectral
Electrical Properties Metric English Comments
Volume Resistivity >= 1.80e+13 ohm-cm
>= 1.80e+13 ohm-cm
Dielectric Constant 3.17

@Frequency 1000 Hz
3.17

@Frequency 1000 Hz
Dissipation Factor 0.0050

@Frequency 1000 Hz
0.0050

@Frequency 1000 Hz
Chemical Properties Metric English Comments
Ionic Impurities - K (Potassium) 5.0 ppm
5.0 ppm
Ionic Impurities - Cl (Chloride) 329 ppm
329 ppm
Processing Properties Metric English Comments
Cure Time 1.00 min

@Temperature 150 °C
0.0167 hour

@Temperature 302 °F
Minimum Bond Line
5.00 min

@Temperature 120 °C
0.0833 hour

@Temperature 248 °F
Minimum Bond Line
10.0 min

@Temperature 100 °C
0.167 hour

@Temperature 212 °F
Minimum Bond Line
30.0 min

@Temperature 80.0 °C
0.500 hour

@Temperature 176 °F
Minimum Bond Line
Pot Life 120 min
120 min
<= 120 min
<= 120 min
Frozen Syringe
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Descriptive Properties Value Comments
Color Amber
Gardner <18, Part B
Clear
Gardner <5, Part A
Consistency Pourable liquid
Ionic Impurities NH4 409 ppm
Mix Ratio By Weight 10:1
Number of Components Two
Weight Loss 0.22%
200°C
0.39%
250°C
0.87%
300°C
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