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Ensinger TECASINT™ 2061 Polyimide, 15% Graphite, 10% PTFE Filled (PI)

Category Polymer , Thermoplastic , Polyimide, Thermoplastic , Thermoplastic Polyimide, Graphite Filled , Thermoplastic Polyimide, Molded, PTFE Filled
Manufacturer Ensinger
Trade Name TECASINT™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Ensinger TECASINT™ 2061 Polyimide, 15% Graphite, 10% PTFE Filled (PI).pdf
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Material Notes:
TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications. TECASINT™ 2011 is very pure, and exhibits low outgassing. It is also characterized by it’s long term thermal stability, outstanding wear resistance, high creep resistance, and strength up to its continuous use temperature of 536° F. TECASINT™ 2021 contains 15% graphite and is also available for applications requiring improved wear resistance & lower coefficient of friction. Superior high temperature characteristics (TECASINT™ 2000 series can operate up to 536° F continuously)Excellent long-term thermal stabilityOutstanding bearing and wear properties (at elevated temperatures, TECASINT™ 2000 formulations offer superior wear rates)Excellent creep resistanceHigh strength and stiffness propertiesHigh purity characteristics (only extremely low levels of extractables and ionic impurities are apparent in TECASINT™ 2011)Good chemical resistance (TECASINT™ 2000 series is not attacked by common solvents or fuels and is acceptable for use in contact with many acids)TECASINT™ 2000 series with their superior physical properties, are ideal for applications in the aerospace, nuclear, automotive, electrical/electronics, and chemical processing industries. TECASINT™ shapes are excellent candidates for high purity applications in the semiconductor processing industry. Typical components produced from TECASINT™ applications include seals, thrust washers, bushings and wear pads in transportation/off-highway equipment, insulating and support elements in electrical welding and brazing equipment, and wafer-handling components in the harsh environment of semiconductor plasma ovens. Pump and valve seals, vanes, and piston rings are also commonly produced from TECASINT™ series materials.Information Provided by Ensinger Inc.
Physical Properties Metric English Comments
Density 1.51 g/cc

@Temperature 23.0 °C
0.0546 lb/in³

@Temperature 73.4 °F
DIN 53 479
Filler Content 10 %
10 %
PTFE
15 %
15 %
Graphite
Water Absorption 0.35 %

@Temperature 23.0 °C,
Time 86400 sec
0.35 %

@Temperature 73.4 °F,
Time 24.0 hour
EN ISO 62
1.5 %

@Temperature 80.0 °C,
Time 86400 sec
1.5 %

@Temperature 176 °F,
Time 24.0 hour
EN ISO 62
Mechanical Properties Metric English Comments
Hardness, Shore D 84

@Temperature 23.0 °C
84

@Temperature 73.4 °F
DIN 53 505
Tensile Strength, Yield 63.0 MPa

@Temperature 23.0 °C
9140 psi

@Temperature 73.4 °F
EN ISO 527
Elongation at Break 2.7 %

@Temperature 23.0 °C
2.7 %

@Temperature 73.4 °F
EN ISO 527
Elongation at Yield 3.3 %
3.3 %
Flexural; EN ISO 178
Tensile Modulus 3.90 GPa

@Temperature 23.0 °C
566 ksi

@Temperature 73.4 °F
EN ISO 527
Flexural Strength 89.0 MPa

@Temperature 23.0 °C
12900 psi

@Temperature 73.4 °F
EN ISO 178
Flexural Modulus 3.49 GPa

@Temperature 23.0 °C
506 ksi

@Temperature 73.4 °F
EN ISO 178
Compressive Yield Strength 142 MPa
20600 psi
10% Strain; EN ISO 604
Compressive Strength 164 MPa

@Temperature 23.0 °C
23800 psi

@Temperature 73.4 °F
EN ISO 604
Compressive Modulus 1.748 GPa

@Temperature 23.0 °C
253.5 ksi

@Temperature 73.4 °F
EN ISO 604
Charpy Impact Unnotched 1.94 J/cm²
9.23 ft-lb/in²
EN ISO 179
Charpy Impact, Notched 0.320 J/cm²

@Temperature 23.0 °C
1.52 ft-lb/in²

@Temperature 73.4 °F
EN ISO 179
Compression Set 16.4 %
16.4 %
Compression at Break; EN ISO 604
Thermal Properties Metric English Comments
Glass Transition Temp, Tg 370 °C
698 °F
DMTA
Flammability, UL94 V-0
V-0
Descriptive Properties Value Comments
Color Shiny Black
DIN-Abbreviation PI CS15 TF10
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