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Ensinger TECASINT™ 2032 Polyimide, Black, 40% Graphite (PI)

Category Polymer , Thermoplastic , Polyimide, Thermoplastic , Thermoplastic Polyimide, Graphite Filled
Manufacturer Ensinger
Trade Name TECASINT™
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Ensinger TECASINT™ 2032 Polyimide, Black, 40% Graphite (PI).pdf
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Material Notes:
TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications. TECASINT™ 2011 is very pure, and exhibits low outgassing. It is also characterized by it’s long term thermal stability, outstanding wear resistance, high creep resistance, and strength up to its continuous use temperature of 536° F. TECASINT™ 2021 contains 15% graphite and is also available for applications requiring improved wear resistance & lower coefficient of friction. Superior high temperature characteristics (TECASINT™ 2000 series can operate up to 536° F continuously)Excellent long-term thermal stabilityOutstanding bearing and wear properties (at elevated temperatures, TECASINT™ 2000 formulations offer superior wear rates)Excellent creep resistanceHigh strength and stiffness propertiesHigh purity characteristics (only extremely low levels of extractables and ionic impurities are apparent in TECASINT™ 2011)Good chemical resistance (TECASINT™ 2000 series is not attacked by common solvents or fuels and is acceptable for use in contact with many acids)TECASINT™ 2000 series with their superior physical properties, are ideal for applications in the aerospace, nuclear, automotive, electrical/electronics, and chemical processing industries. TECASINT™ shapes are excellent candidates for high purity applications in the semiconductor processing industry. Typical components produced from TECASINT™ applications include seals, thrust washers, bushings and wear pads in transportation/off-highway equipment, insulating and support elements in electrical welding and brazing equipment, and wafer-handling components in the harsh environment of semiconductor plasma ovens. Pump and valve seals, vanes, and piston rings are also commonly produced from TECASINT™ series materials.Information Provided by Ensinger Inc.
Physical Properties Metric English Comments
Density 1.49 g/cc
0.0538 lb/in³
DIN 53 479
Water Absorption 1.81 %

@Temperature 23.0 °C
1.81 %

@Temperature 73.4 °F
24 hours in water; EN ISO 62
2.48 %

@Temperature 80.0 °C
2.48 %

@Temperature 176 °F
24 hours in water; EN ISO 62
Mechanical Properties Metric English Comments
Hardness, Shore D 80

@Temperature 23.0 °C
80

@Temperature 73.4 °F
DIN 53 505
Tensile Strength 40.0 MPa

@Temperature 23.0 °C
5800 psi

@Temperature 73.4 °F
EN ISO 527
Elongation at Break 1.7 %

@Temperature 23.0 °C
1.7 %

@Temperature 73.4 °F
EN ISO 527
Elongation at Yield 1.8 %

@Temperature 23.0 °C
1.8 %

@Temperature 73.4 °F
Flexural Elongation; EN ISO 178
Tensile Modulus 3.494 GPa

@Temperature 23.0 °C
506.8 ksi

@Temperature 73.4 °F
EN ISO 527
Flexural Strength 57.0 MPa

@Temperature 23.0 °C
8270 psi

@Temperature 73.4 °F
EN ISO 178
Flexural Modulus 3.44 GPa

@Temperature 23.0 °C
499 ksi

@Temperature 73.4 °F
EN ISO 178
Compressive Yield Strength 110 MPa

@Strain 10.0 %,
Temperature 23.0 °C
16000 psi

@Strain 10.0 %,
Temperature 73.4 °F
EN ISO 604
Compressive Strength 128 MPa

@Temperature 23.0 °C
18600 psi

@Temperature 73.4 °F
EN ISO 604
Compressive Modulus 1.446 GPa

@Temperature 23.0 °C
209.7 ksi

@Temperature 73.4 °F
EN ISO 604
Charpy Impact Unnotched 0.780 J/cm²

@Temperature 23.0 °C
3.71 ft-lb/in²

@Temperature 73.4 °F
EN ISO 179
Charpy Impact, Notched 0.250 J/cm²

@Temperature 23.0 °C
1.19 ft-lb/in²

@Temperature 73.4 °F
EN ISO 179
Compression Set 18 %

@Temperature 23.0 °C
18 %

@Temperature 73.4 °F
Compression at Break; EN ISO 604
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 300 °C
572 °F
Glass Transition Temp, Tg 370 °C
698 °F
DMTA
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