Dymax 3069P Fast Shallow Potting Compound and Sealant

Shallow Potting and Sealing in SecondsFeaturesUV cures in seconds to 1/4 inch deepOne component, no mixingSolvent-freeEnvironmentally friendlyExcellent adhesion to most substratesDescriptionUV curable potting materials are used for sealing electrical connectors, temperature probes and sensors in applications throughout the aerospace, electronic, electrical, industrial, defense and marine industries. Dymax pitting compounds cure in seconds, on demand, and have very low shrinkage. See pages for a selection of Dymax UV curing lamps and conveyors which can lower production costs when used in conjunction with Dymax adhesives.Dymax 3069P Fast Shallow Potting Compound and SealantContains no (meth) acrylic acid; low V.O.C. Key Substrates: Metal Typical Use: Sensors