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Dow Corning TC-5021 Thermally Conductive Compound

Category Polymer , Adhesive , Thermoset , Silicone , Silicone, RTV, Adhesive/Sealant Grade
Manufacturer Dow Corning
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Dow Corning TC-5021 Thermally Conductive Compound.pdf
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Material Notes:
Non-curing, thermally conductive silicone paste, low thermal resistance, high thermal conductivity.Information provided by Dow Corning
Physical Properties Metric English Comments
Specific Gravity 3.50 g/cc

@Temperature 25.0 °C
3.50 g/cc

@Temperature 77.0 °F
Viscosity 102000 cP
102000 cP
Dynamic
Thermal Properties Metric English Comments
Thermal Conductivity 3.30 W/m-K
22.9 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 200 °C
392 °F
Minimum Service Temperature, Air -45.0 °C
-49.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 3.70e+11 ohm-cm
3.70e+11 ohm-cm
Dielectric Strength 5.04 kV/mm
128 kV/in
Processing Properties Metric English Comments
Shelf Life 24.0 Month
24.0 Month
Descriptive Properties Value Comments
Color Grey
Cyclotetrasiloxane Content (%) <1
Flowable Yes
Hydrophobic Yes
Self Leveling Yes
Water Resistant Yes
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