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Devcon Backing Compound Epoxy
| Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive |
| Manufacturer | Devcon |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Devcon Backing Compound Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Abrasion-Resistant SystemData provided by Ellsworth Adhesives.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 1.61 g/cc | 0.0581 lb/in³ | |
| Viscosity | 4700 cP | 4700 cP | with hardener |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 92 | 92 | ASTM D2240 |
| Tensile Strength, Ultimate | 37.90 MPa | 5497 psi | ASTM D638 |
| Modulus of Elasticity | 6.34 GPa | 920 ksi | In Tension; ASTM D638 |
| Flexural Yield Strength | 59.01 MPa | 8558 psi | ASTM D790 |
| Compressive Yield Strength | 95.70 MPa | 13880 psi | ASTM D695 |
| Adhesive Bond Strength | 13.8 MPa | 2000 psi | Adhesive tensile shear strength; ASTM D1002 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 40.0 µm/m-°C @Temperature 20.0 °C |
22.2 µin/in-°F @Temperature 68.0 °F |
ASTM D696 |
| Maximum Service Temperature, Air | 121 °C | 250 °F | Operating Temperature |
| Shrinkage | 0.10 % | 0.10 % | During Cure; ASTM D2566 |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Processing Temperature | 21.1 °C | 70.0 °F | |
| Pot Life | 15.0 min @Temperature 23.9 °C |
15.0 min @Temperature 75.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Coverage per 20.3 lb. | 347 in² | |
| Mix Ratio by Volume | 9 to 1 | resin:hardener |
| Mix Ratio By Weight | 100 to 6.84 | resin:hardener |
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