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DSM Somos® 9120

Category	Polymer , Rapid Prototyping Polymer
Manufacturer	DSM Somos
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	DSM Somos® 9120.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

The need for movable parts is a constant when it comes to prototyping. Being able to ensure the proper fit for parts within a component can save both time and money. Somos® 9120 creates semi-transparent parts that can allow you to see the inner working of parts you are creating. You can count on this material to simplify processes, such as in wiring and cable projects for electronic or automotive applications.

Physical Properties	Metric	English	Comments
Density	1.13 g/cc	0.0408 lb/in³
Viscosity	450 cP @Temperature 30.0 °C	450 cP @Temperature 86.0 °F

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80 - 82	80 - 82	UV Postcure; ASTM D2240
Tensile Strength, Ultimate	30.0 - 32.0 MPa	4350 - 4640 psi	UV Postcure; ASTM D638M
	31.0 - 37.2 MPa	4500 - 5400 psi	Polypropylene; ASTM D638M
Elongation at Yield	7.0 - 13 %	7.0 - 13 %	Polypropylene; ASTM D638M
	15 - 25 %	15 - 25 %	UV Postcure; ASTM D638M
Modulus of Elasticity	1.138 - 1.551 GPa	165.1 - 225.0 ksi	Polypropylene; ASTM D368M
	1.227 - 1.462 GPa	178.0 - 212.0 ksi	UV Postcure; ASTM D368M
Flexural Strength	44.0 - 46.0 MPa	6380 - 6670 psi	UV Postcure; ASTM D790M
	41.0 - 55.0 MPa	5950 - 7980 psi	Polypropylene; ASTM D790M
Flexural Modulus	1.31 - 1.455 GPa	190 - 211.0 ksi	UV Postcure; ASTM D790M
	1.172 - 1.724 GPa	170.0 - 250.0 ksi	Polypropylene; ASTM D790M
Izod Impact, Notched	0.480 - 0.530 J/cm	0.899 - 0.993 ft-lb/in	UV Postcure; ASTM D256A

Thermal Properties	Metric	English	Comments
Deflection Temperature at 0.46 MPa (66 psi)	52.0 - 61.0 °C	126 - 142 °F	ASTM D648-07

Descriptive Properties	Value	Comments
Appearance	Off White
DP (mils)	5.6	Slope of cure-depth vs. ln (E) curve
E10 (mJ/cm2)	65	exposure that gives 0.254 mm (0.010 inch) thickness
Ec (mJ/cm2)	10.9	Critical Exposure

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