Cytec (Conap) FR-2000 / FR-200 Conapoxy® Resin / Conacure® Hardener

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer	Cytec
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Cytec (Conap) FR-2000 / FR-200 Conapoxy® Resin / Conacure® Hardener.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.Cytec (Conap) FR-2000 / FR-200 Conapoxy® Resin / Conacure® HardenerA filled system with superior acid resistance. Curing at room temperature or low elevated temperatures.Mix Ratio, Resin/Hardener (by weight): 100/26 Cure Type: Elevated Temperature

Physical Properties	Metric	English	Comments
Viscosity	300 cP @Temperature 25.0 °C	300 cP @Temperature 77.0 °F

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	90	90

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	130 °C	266 °F

Electrical Properties	Metric	English
Volume Resistivity	<= 3.60e+15 ohm-cm	<= 3.60e+15 ohm-cm
Dielectric Constant	4.07 @Frequency 1000 Hz	4.07 @Frequency 1000 Hz
Dielectric Strength	24.3 kV/mm	616 kV/in
Dissipation Factor	0.12 @Frequency 1000 Hz	0.12 @Frequency 1000 Hz

Processing Properties	Metric	English	Comments
Cure Time	60.0 min @Temperature 47.0 °C	1.00 hour @Temperature 117 °F
Pot Life	40.0 min @Temperature 25.0 °C	40.0 min @Temperature 77.0 °F	100 grams

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