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Cytec (Conap) FR-1210 / EA-117 Conapoxy® Resin / Conacure® Hardener

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Cytec
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cytec (Conap) FR-1210 / EA-117 Conapoxy® Resin / Conacure® Hardener.pdf
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Material Notes:
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive and related industries.Cytec (Conap) FR-1210 / EA-117 Conapoxy® Resin / Conacure® HardenerFilled version of RN-1200 with lower shrinkage, improved thermal properties and lower coefficient of expansion.Mix Ratio, Resin/Hardener (by weight): 100/10 Cure Type: Elevated Temperature
Physical Properties Metric English Comments
Viscosity 10000 cP

@Temperature 25.0 °C
10000 cP

@Temperature 77.0 °F
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
Thermal Properties Metric English Comments
Maximum Service Temperature, Air 155 °C
311 °F
Electrical Properties Metric English Comments
Volume Resistivity <= 4.00e+14 ohm-cm
<= 4.00e+14 ohm-cm
Dielectric Constant 4.0

@Frequency 1000 Hz
4.0

@Frequency 1000 Hz
Dielectric Strength 14.6 kV/mm
370 kV/in
Dissipation Factor 0.029

@Frequency 1000 Hz
0.029

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time >= 180 min

@Temperature 130 °C
>= 3.00 hour

@Temperature 266 °F
Pot Life 60.0 min

@Temperature 40.0 °C
60.0 min

@Temperature 104 °F
100 grams
480 min

@Temperature 25.0 °C
480 min

@Temperature 77.0 °F
100 grams
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