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Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound  (discontinued **)

Category Polymer , Thermoset , Epoxy , Epoxy Molding Compound
Manufacturer
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® AMC2 (132.203) Epoxy Molding Compound  (discontinued **).pdf
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Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.An epoxy molding compound specifically formulated for packaging stress-sensitive devices in DIPs, SOICs, PLCCs and small QFPs. Features: no post mold cure, high productivity, JEDEC level 1 for SOICs and SSOPs Thermal properties given As Molded
Physical Properties Metric English Comments
Density 1.92 g/cc
0.0694 lb/in³
Viscosity 7500 cP

@Temperature 175 °C
7500 cP

@Temperature 347 °F
Automatic orifice Viscosity
Spiral Flow 76.0 cm
29.9 in
175°C/1000 psi
Mechanical Properties Metric English Comments
Hardness, Shore D 76
76
Flexural Strength 132 MPa
19100 psi
Flexural Modulus 17.0 GPa
2470 ksi
Thermal Properties Metric English Comments
CTE, linear 14.0 µm/m-°C

@Temperature 20.0 °C
7.78 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 63.0 µm/m-°C

@Temperature 20.0 °C
35.0 µin/in-°F

@Temperature 68.0 °F
Glass Transition Temp, Tg 147 °C
297 °F
Flammability, UL94 V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
Electrical Properties Metric English Comments
Electrical Resistivity 3.50e+15 ohm-cm
3.50e+15 ohm-cm
Dielectric Constant 3.55

@Frequency 1000 Hz
3.55

@Frequency 1000 Hz
Dielectric Strength 31.0 kV/mm
787 kV/in
Dissipation Factor 0.0023

@Frequency 1000 Hz
0.0023

@Frequency 1000 Hz
Processing Properties Metric English Comments
Processing Temperature 175 °C
347 °F
Molding temperature
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