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Cookson Group Plaskon® 1002 Conventional Encapsulant  (discontinued **)

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® 1002 Conventional Encapsulant  (discontinued **).pdf
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Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, low stress, conventional molding compound recommended for high volume commodity-type packages that house simple linear and discrete devices. These packages include low lead count DIPs, TO-types, diodes and small SOICs. Excellent moldability (fast curing, minimal if any deflashing, no degreasing); Superior cosmetics and markability; Low stress
Physical Properties Metric English Comments
Density 1.86 g/cc
0.0672 lb/in³
Viscosity 16500 cP

@Temperature 175 °C
16500 cP

@Temperature 347 °F
Automatic orifice Viscosity
Spiral Flow 63.0 - 87.0 cm
24.8 - 34.3 in
177°C/1000 psi
Mechanical Properties Metric English Comments
Hardness, Shore D 81
81
Flexural Strength 131 MPa
19000 psi
Flexural Modulus 17.0 GPa
2470 ksi
Thermal Properties Metric English Comments
CTE, linear 18.0 µm/m-°C

@Temperature 20.0 °C
10.0 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 56.0 µm/m-°C

@Temperature 20.0 °C
31.1 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K
4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 153 °C
307 °F
Flammability, UL94 V-0

@Thickness 1.60 mm
V-0

@Thickness 0.0630 in
V-0

@Thickness 1.60 mm
V-0

@Thickness 0.0630 in
Electrical Properties Metric English Comments
Dielectric Constant 3.8

@Frequency 1000 Hz
3.8

@Frequency 1000 Hz
Dielectric Strength 16.0 kV/mm
406 kV/in
Dissipation Factor 0.0020

@Frequency 1000 Hz
0.0020

@Frequency 1000 Hz
Arc Resistance 180 sec
180 sec
Processing Properties Metric English Comments
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
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