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Celanese Hostaform® C 9021 G POM, Tribological  (Unverified Data**)

Category Polymer , Thermoplastic , Acetal (POM)
Manufacturer
Trade Name Hostaform®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Celanese Hostaform® C 9021 G POM, Tribological  (Unverified Data**).pdf
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Material Notes:
Chemical abbreviation according to ISO 1043-1: POMInjection molding type like C 9021, with (R) GUR (PE-UHMW) modifiedInformation provided by Celanese
Physical Properties Metric English Comments
Density 1.34 g/cc
0.0484 lb/in³
ISO 1183
Water Absorption 0.80 %
0.80 %
ISO 62
Linear Mold Shrinkage, Flow 0.023 cm/cm
0.023 in/in
ISO 294-4
Linear Mold Shrinkage, Transverse 0.018 cm/cm
0.018 in/in
ISO 294-4
Melt Flow 5.5 g/10 min

@Load 2.16 kg,
Temperature 190 °C
5.5 g/10 min

@Load 4.76 lb,
Temperature 374 °F
(MVR) cm³/10min; ISO 1133
Mechanical Properties Metric English Comments
Tensile Strength, Yield 45.0 MPa
6530 psi
50mm/min; ISO 527-2/1A
Elongation at Break 10 %
10 %
50mm/min; ISO 527-2/1A
Elongation at Yield 9.0 %
9.0 %
50mm/min; ISO 527-2/1A
Tensile Modulus 2.30 GPa
334 ksi
1mm/min; ISO 527-2/1A
Flexural Modulus 2.10 GPa
305 ksi
ISO 178
Charpy Impact Unnotched 3.00 J/cm²
14.3 ft-lb/in²
ISO 179/1eU
3.00 J/cm²

@Temperature -30.0 °C
14.3 ft-lb/in²

@Temperature -22.0 °F
ISO 179/1eU
Charpy Impact, Notched 0.350 J/cm²
1.67 ft-lb/in²
ISO 179/1eA
0.300 J/cm²

@Temperature -30.0 °C
1.43 ft-lb/in²

@Temperature -22.0 °F
ISO 179/1eA
Tensile Creep Modulus, 1 hour 2000 MPa
290000 psi
ISO 899-1
Tensile Creep Modulus, 1000 hours 1300 MPa
189000 psi
ISO 899-1
Thermal Properties Metric English Comments
CTE, linear 120 µm/m-°C
66.7 µin/in-°F
ISO 11359-2
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Deflection Temperature at 1.8 MPa (264 psi) 88.0 °C
190 °F
ISO 75-1, -2
Flame Spread <= 100 mm/min
<= 3.94 in/min
ISO 3795 and FMVSS 302
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+14 ohm-cm
1.00e+14 ohm-cm
IEC 60093
Surface Resistance 1.00e+14 ohm
1.00e+14 ohm
IEC 60093
Dielectric Constant 3.8

@Frequency 100 Hz
3.8

@Frequency 100 Hz
IEC 60250
3.8

@Frequency 1.00e+6 Hz
3.8

@Frequency 1.00e+6 Hz
IEC 60250
Dielectric Strength 35.0 kV/mm
889 kV/in
IEC 60243-1
Dissipation Factor 0.0025

@Frequency 100 Hz
0.0025

@Frequency 100 Hz
IEC 60250
0.0070

@Frequency 1.00e+6 Hz
0.0070

@Frequency 1.00e+6 Hz
IEC 60250
Comparative Tracking Index 600 V
600 V
IEC 60112
Processing Properties Metric English Comments
Processing Temperature 20.0 - 30.0 °C
68.0 - 86.0 °F
80.0 - 120 °C
176 - 248 °F
Cavity temperature
Feed Temperature 60.0 - 80.0 °C
140 - 176 °F
Zone 1 170 - 180 °C
338 - 356 °F
Zone 2 180 - 190 °C
356 - 374 °F
Zone 3 190 - 200 °C
374 - 392 °F
Zone 4 190 - 210 °C
374 - 410 °F
Die Temperature 190 - 210 °C
374 - 410 °F
Melt Temperature 190 - 230 °C
374 - 446 °F
Mold Temperature 80.0 - 120 °C
176 - 248 °F
Drying Temperature 100 - 120 °C
212 - 248 °F
Dry Time 3.00 - 4.00 hour
3.00 - 4.00 hour
Moisture Content 0.15 %
0.15 %
Necessary low maximum residual
Injection Pressure 60.0 - 120 MPa
8700 - 17400 psi
Hold Pressure 60.0 - 120 MPa
8700 - 17400 psi
Back Pressure 2.00 MPa
290 psi
Screw Speed 70 rpm

@Diameter 55.0 mm
70 rpm

@Diameter 2.17 in
100 rpm

@Diameter 40.0 mm
100 rpm

@Diameter 1.57 in
150 rpm

@Diameter 25.0 mm
150 rpm

@Diameter 0.984 in
Hot-Working Temperature 190 - 210 °C
374 - 410 °F
Descriptive Properties Value Comments
Injection molding Yes
Injection Speed slow
Longer pre-drying times/storage The product can then be stored in standard conditions until processed.
Pre-drying Drying is not normally required with proper storage
Processing conditions ISO 9988
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