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CP-Polymer-Technik Wellamid® 6600 GS 30 HWCP 30% Glass Sphere Filled Nylon 66, Heat Stabilized, Dry

Category Polymer , Thermoplastic , Nylon , Nylon 66 , Nylon 66, Glass Bead Filled
Manufacturer CP-Polymer-Technik GmbH & Co.
Trade Name Wellamid®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF CP-Polymer-Technik Wellamid® 6600 GS 30 HWCP 30% Glass Sphere Filled Nylon 66, Heat Stabilized, Dry.pdf
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Material Notes:
Information provided by CP-Polymer-Technik GmbH & Co. KG
Physical Properties Metric English Comments
Density 1.35 g/cc
0.0488 lb/in³
ISO 1183
Moisture Absorption at Equilibrium 1.8 - 2.3 %
1.8 - 2.3 %
23°C/50%RH; DIN 53495
Linear Mold Shrinkage 0.0090 - 0.011 cm/cm

@Thickness 4.00 mm
 0.0090 - 0.011 in/in

@Thickness 0.157 in
Mechanical Properties Metric English Comments
Tensile Strength at Break 83.0 MPa
12000 psi
5 mm/min; ISO 527
Elongation at Break 5.0 %
5.0 %
5 mm/min; ISO 527
Tensile Modulus 4.60 GPa
667 ksi
ISO 527
Flexural Modulus 4.00 GPa
580 ksi
DIN 52457
Charpy Impact Unnotched 2.50 J/cm²

@Temperature 23.0 °C
 11.9 ft-lb/in²

@Temperature 73.4 °F
 ISO 179
Charpy Impact, Notched 0.600 J/cm²

@Temperature 23.0 °C
 2.86 ft-lb/in²

@Temperature 73.4 °F
 ISO 179
Thermal Properties Metric English Comments
CTE, linear 50.0 µm/m-°C

@Temperature 23.0 - 80.0 °C
 27.8 µin/in-°F

@Temperature 73.4 - 176 °F
 DIN 53752
Melting Point 255 °C
491 °F
Kofler
Deflection Temperature at 0.46 MPa (66 psi) 205 °C
401 °F
ISO 179
Deflection Temperature at 1.8 MPa (264 psi) 120 °C
248 °F
ISO 179
Vicat Softening Point 230 °C
446 °F
50 N; ISO 306
Flammability, UL94 HB

@Thickness 1.60 mm
 HB

@Thickness 0.0630 in
 Stufe; IEC 707
HB

@Thickness 3.20 mm
 HB

@Thickness 0.126 in
 Stufe; IEC 707
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+15 ohm-cm
1.00e+15 ohm-cm
IEC 93
Surface Resistance 1.00e+12 ohm
1.00e+12 ohm
ISO 3915
Dielectric Constant 4.0

@Frequency 1e+6 Hz
 4.0

@Frequency 1e+6 Hz
 IEC 250
Dielectric Strength 35.0 kV/mm
889 kV/in
IEC 243-1
Dielectric Loss Index 0.015
0.015
At 1 MHz; IEC 250
Comparative Tracking Index 450 V
450 V
Stufe; IEC 112
Processing Properties Metric English Comments
Melt Temperature 265 - 290 °C
509 - 554 °F
Mold Temperature 70.0 - 100 °C
158 - 212 °F
Descriptive Properties Value Comments
Back Pressure Low
Holding Pressure High
Injection Speed Medium to High
Screw Speed Medium
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