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CP-Polymer-Technik Wellamid® 6600 GS 15 HWCP 15% Glass Sphere Filled Nylon 66, Heat Stabilized, Conditioned

Category Polymer , Thermoplastic , Nylon , Nylon 66 , Nylon 66, Glass Bead Filled
Manufacturer CP-Polymer-Technik GmbH & Co.
Trade Name Wellamid®
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF CP-Polymer-Technik Wellamid® 6600 GS 15 HWCP 15% Glass Sphere Filled Nylon 66, Heat Stabilized, Conditioned.pdf
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Material Notes:
Information provided by CP-Polymer-Technik GmbH & Co. KG
Physical Properties Metric English Comments
Density 1.23 g/cc
0.0444 lb/in³
ISO 1183
Moisture Absorption at Equilibrium 2.2 - 2.7 %
2.2 - 2.7 %
23°C/50%RH, Starting when dry; DIN 53495
Linear Mold Shrinkage 0.0090 - 0.011 cm/cm

@Thickness 4.00 mm
0.0090 - 0.011 in/in

@Thickness 0.157 in
Mechanical Properties Metric English Comments
Tensile Strength at Break 45.0 MPa
6530 psi
5 mm/min; ISO 527
Elongation at Break 20 %
20 %
5 mm/min; ISO 527
Tensile Modulus 1.70 GPa
247 ksi
ISO 527
Charpy Impact Unnotched 4.20 J/cm²

@Temperature 23.0 °C
20.0 ft-lb/in²

@Temperature 73.4 °F
ISO 179
Charpy Impact, Notched 1.20 J/cm²

@Temperature 23.0 °C
5.71 ft-lb/in²

@Temperature 73.4 °F
ISO 179
Thermal Properties Metric English Comments
Melting Point 255 °C
491 °F
Kofler
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+12 ohm-cm
1.00e+12 ohm-cm
IEC 93
Surface Resistance 1.00e+10 ohm
1.00e+10 ohm
ISO 3915
Dielectric Constant 6.0

@Frequency 1e+6 Hz
6.0

@Frequency 1e+6 Hz
IEC 250
Dielectric Strength 35.0 kV/mm
889 kV/in
IEC 243-1
Dielectric Loss Index 0.15
0.15
At 1 MHz; IEC 250
Processing Properties Metric English Comments
Melt Temperature 265 - 290 °C
509 - 554 °F
Mold Temperature 70.0 - 100 °C
158 - 212 °F
Descriptive Properties Value Comments
Back Pressure Low
Holding Pressure High
Injection Speed Medium to High
Screw Speed Medium
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