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Atom Adhesives AA-DUCT 2919 Epoxy Adhesive

Category Polymer , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Atom Adhesives
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Atom Adhesives AA-DUCT 2919 Epoxy Adhesive.pdf
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Material Notes:
AA-DUCT 2919 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require good flexibility coupled with good electrical and mechanical properties. This two-part, thixotropic adhesive of refined pure silver and epoxy resin components is free of solvents and copper or carbon additives. It develops resilient, electrically and thermally conducting bonds and coatings between many different and dissimilar materials such as metals, ceramics, glass and plastic insulates. AA-DUCT 2919 cures at room temperature and can be used as a flexible "cold-solder" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, membrane switches, wave guides, flat cable and high frequency shields.Appearance: SilverCure Type: Heat cure or Room temperature Mix Ratio by weight: 90:100/Resin:Hardener Benefits: Free of solvents and copper or carbon additivesCoatings between many different and dissimilar materials Substrates: Metal, Ceramics, Glass and Plastic Typical Application: Assembly and repair of electrical modules, flexible circuts, membrane switches, wave guides, flat cable and high frequency shieldsElectronic bonding, coating and sealing applicationsCan be used as a flexible “cold-solder”Information provided by Atom Adhesives
Mechanical Properties Metric English Comments
Hardness, Shore D 80
80
Adhesive Bond Strength 0.621 MPa

@Temperature 25.0 °C,
Time 86400 sec
90.0 psi

@Temperature 77.0 °F,
Time 24.0 hour
Lap shear, alum to alum
1.17 MPa

@Temperature 65.0 °C,
Time 14400 sec
170 psi

@Temperature 149 °F,
Time 4.00 hour
Lap shear, alum to alum
Thermal Properties Metric English Comments
CTE, linear 34.9 µm/m-°C
19.4 µin/in-°F
Thermal Conductivity 1.60 W/m-K
11.1 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 110 °C
230 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Glass Transition Temp, Tg 4.00 °C
39.2 °F
Electrical Properties Metric English Comments
Volume Resistivity 0.00011 ohm-cm
0.00011 ohm-cm
cured 4 hrs @ 65°C
0.0016 ohm-cm
0.0016 ohm-cm
cured 24 hrs @ 25°C
Processing Properties Metric English Comments
Cure Time 240 min

@Temperature 65.0 °C
4.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Shelf Life 12.0 Month
12.0 Month
Descriptive Properties Value Comments
Thixotropic Index 4.9
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