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Atom Adhesives AA-BOND 2104 Epoxy Adhesive

Category Polymer , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer Atom Adhesives
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Atom Adhesives AA-BOND 2104 Epoxy Adhesive.pdf
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Material Notes:
AA-BOND 2104 is a thixotropic epoxy system recommended for critical electronics, aerospace and industrial bonding, laminating and reinforcing applications requiring an adhesive with high-fill, non-sag characteristic. AA-BOND 2104 solvent-free adhesive is easily mixed and used for staking components to printed circuit boards for enhanced mechanical rigidity, and for bonding, laminating and repair applications involving metals, glass, ceramics, wood and many plastics. AA-BOND 2104 hardens to a tough, enamel-like coating offering good chemical resistance as well as superior physical and mechanical properties. AA-BOND 2104 provides good electrical insulation and resistance to weather, galvanic action, petroleum products and lubricants, alcohol, salts, mild acids and alkalis, and other organic and inorganic compounds.Appearance: Milky, TranslucentCure Type: Heat cure or Room TemperatureBenefits:Great for aerospace applicationsGreat for reinforcing applicationsBonds to many substrates Mix Ratio by weight: 100:22/Resin:HardenerSubstrates: metals, glass, ceramics, wood and many plasticsTypical Application: PCB components, aerospace, anything where superior properties are required, staking components, bonding, laminating, repair applicationsInformation provided by Atom Adhesives
Physical Properties Metric English Comments
Specific Gravity 1.19 g/cc
1.19 g/cc
uncured
Solids Content 100 %
100 %
uncured
Mechanical Properties Metric English Comments
Hardness, Shore D 88
88
Izod Impact, Notched 0.400 J/cm
0.750 ft-lb/in
Thermal Properties Metric English Comments
CTE, linear 55.1 µm/m-°C
30.6 µin/in-°F
Maximum Service Temperature, Air 125 °C
257 °F
Minimum Service Temperature, Air -60.0 °C
-76.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 6.00e+13 ohm-cm
6.00e+13 ohm-cm
1.00e+10 ohm-cm

@Temperature 100 °C
1.00e+10 ohm-cm

@Temperature 212 °F
Dielectric Constant 4.6

@Frequency 1000 Hz
4.6

@Frequency 1000 Hz
Dielectric Strength 16.1 kV/mm
410 kV/in
Dissipation Factor 0.010

@Frequency 1000 Hz
0.010

@Frequency 1000 Hz
Processing Properties Metric English Comments
Cure Time 240 min

@Temperature 65.0 °C
4.00 hour

@Temperature 149 °F
1440 min

@Temperature 25.0 °C
24.0 hour

@Temperature 77.0 °F
Pot Life 30.0 min
30.0 min
uncured
Shelf Life 12.0 Month
12.0 Month
uncured
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