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Arlon CuClad 6250 Bonding Film

Category Polymer , Thermoplastic
Manufacturer Arlon
Trade Name CuClad
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Arlon CuClad 6250 Bonding Film.pdf
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Material Notes:
Thermoplastic Bonding FilmsSimilar Dk and Df range to many PTFE laminatesBenefits:Can be reheated to remelt and reflow bonding filmExcellent Electrical PropertiesTypical Applications:Stripline CircuitryMulti-Layer Boards and Hybrid Con instructions for Microwave applicationsAttachment of Circuit Boards to Heavy Plate Heat SinksInformation provided by Arlon Materials for Electronics (MED).
Physical Properties Metric English Comments
Density 0.930 g/cc
0.0336 lb/in³
ASTM D1505
Thickness 0.0381 microns
0.00150 mil
Thermal Properties Metric English Comments
Thermal Conductivity 0.170 W/m-K
1.18 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air <= 75.0 °C
<= 167 °F
Continuous Use
Brittleness Temperature -60.0 °C
-76.0 °F
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+16 ohm-cm
1.00e+16 ohm-cm
ASTM D257
Dielectric Constant 2.32

@Frequency 1.00e+10 Hz
2.32

@Frequency 1.00e+10 Hz
IPC TM-650
Dielectric Strength >= 39.4 kV/mm
>= 1000 kV/in
ASTM D149
Dissipation Factor 0.0013

@Frequency 1.00e+10 Hz
0.0013

@Frequency 1.00e+10 Hz
IPC TM-650
Arc Resistance 130 - 140 sec
130 - 140 sec
ASTM D495
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