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Arlon CLTE-AT Commercial Ceramic PTFE
| Category | Polymer , Thermoplastic , Fluoropolymer , PTFE |
| Manufacturer | Arlon |
| Trade Name | |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Arlon CLTE-AT Commercial Ceramic PTFE.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Microwave material for improved thermal management, Excellent dimensional stability with high degree of phase stability vs. temperature.CLTE-AT is a micro-dispersed ceramic PTFE composite utilizing a woven fiberglass reinforcement to provide the highest degree of stability, critical in multi-layer designs.Ceramic/PTFE microwave compositeMechanically more robust and more dimensionally stable than alternativesHigh thermal conductivityLowest Insertion Loss in commercial classVery low Loss Tangent (0.0013)Tight Dielectric constant and Thickness toleranceElectrical phase stability vs. temperatureBenefits:Excellent thermal stability of Dk and DfPhase stability across temperature High degree of Dimensional stability required for complex, multi-layer boardsExcellent CTE in X, Y and ZTypical Applications:Automotive Radar & Adaptive Cruise Control ApplicationsMicrowave/RF ApplicationsPhase/Temperature Sensitive AntennasPhase Sensitive Electronic ApplicationsRF and Microwave FiltersThis data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 2.06 g/cc | 0.0744 lb/in³ | ASTM D792 Method A |
| Water Absorption | 0.030 % | 0.030 % | IPC TM-650 2.6.2.1 |
| Outgassing - Total Mass Loss | 0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C |
0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F |
Collected Volatiles; NASA SP-R-0022A |
| 0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C |
0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F |
Water Vapor Recovered; NASA SP-R-0022A | |
| 0.040 % @Pressure <=1.33e-10 MPa, Temperature 125 °C |
0.040 % @Pressure <=1.93e-8 psi, Temperature 257 °F |
NASA SP-R-0022A |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Strength | 30.3 MPa | 4400 psi | Cross; IPC TM-650 2.4.18.3 |
| 48.3 MPa | 7000 psi | Machine; IPC TM-650 2.4.18.3 | |
| Modulus of Elasticity | 1.79 GPa | 260 ksi | IPC TM-650 2.4.18.3 |
| Flexural Strength | 53.8 MPa | 7800 psi | Cross; IPC TM-650 2.4.4 |
| 101 MPa | 14600 psi | Machine; IPC TM-650 2.4.4 | |
| Compressive Modulus | 1.68 GPa | 244 ksi | ASTM D3410 |
| Poissons Ratio | 0.17 | 0.17 | ASTM D3039 |
| Shear Modulus | 0.760 GPa | 110 ksi | Calculated |
| Peel Strength | 1.23 kN/m | 7.00 pli | To Copper (1 oz./35 micron); After Process Solutions; IPC TM-650 2.4.8 |
| 1.23 kN/m | 7.00 pli | To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8 | |
| 1.58 kN/m | 9.00 pli | To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 8.00 µm/m-°C @Temperature 50.0 - 150 °C |
4.44 µin/in-°F @Temperature 122 - 302 °F |
IPC TM-650 2.4.41 |
| CTE, linear, Transverse to Flow | 20.0 µm/m-°C @Temperature 50.0 - 150 °C |
11.1 µin/in-°F @Temperature 122 - 302 °F |
z direction; IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.640 W/m-K | 4.44 BTU-in/hr-ft²-°F | ASTM E1461 |
| Decomposition Temperature | 487 °C | 909 °F | Onset; IPC TM-650 2.4.24.6 |
| 529 °C | 984 °F | 5 percent; IPC TM-650 2.4.24.6 | |
| Flammability, UL94 | V-0 | V-0 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 4.25e+14 ohm-cm | 4.25e+14 ohm-cm | C96/35/90; IPC TM-650 2.5.17.1 |
| Surface Resistance | 2.02e+14 ohm | 2.02e+14 ohm | C96/35/90; IPC TM-650 2.5.17.1 |
| Dielectric Constant | 3.0 @Frequency 1.00e+10 Hz |
3.0 @Frequency 1.00e+10 Hz |
IPC TM-650 2.5.5.3 |
| Dielectric Breakdown | 58000 V | 58000 V | IPC TM-650 2.5.6 |
| Dissipation Factor | 0.00125 @Temperature -20.0 °C |
0.00125 @Temperature -4.00 °F |
|
| 0.014 @Temperature 120 °C |
0.014 @Temperature 248 °F |
||
| 0.0013 @Frequency 1.00e+6 Hz |
0.0013 @Frequency 1.00e+6 Hz |
IPC TM-650 2.5.5.3 | |
| 0.0013 @Frequency 1.00e+10 Hz |
0.0013 @Frequency 1.00e+10 Hz |
IPC TM-650 2.5.5.5 | |
| Arc Resistance | 250 sec | 250 sec | IPC TM-650 2.5.1 |
| Descriptive Properties | Value | Comments |
|---|---|---|
| IPC Delamination - T260 (minutes) | > 60 | IPC TM-650 2.4.24.1 |
| IPC Delamination - T288 (minutes) | > 60 | IPC TM-650 2.4.24.1 |
| IPC Delamination - T300 (minutes) | > 60 | IPC TM-650 2.4.24.1 |
| Temperature Coefficient of Dielectric (ppm/°C) | -10 | IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C) |
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