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Arlon AD600 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards

Category Polymer , Thermoplastic , Fluoropolymer , PTFE
Manufacturer Arlon
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Arlon AD600 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards.pdf
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Material Notes:
Ceramic Filled High Dielectric ConstantMechanically Robust; replaces brittle laminates that cannot withstand processing, impact or High G forcesLarge Panel SizesHigh Peel Strength for Narrow LinesBenefits:Circuit MiniaturizationReplace Ceramic in Some ApplicationsImproved Processing and ReliabilityLarge Panel Sizes for Multiple Circuit Layout and lower cost ProcessingTypical Applications:Microwave Combiner and Power Divider BoardsPower Amplifiers, Filters and CouplersSmaller Footprint AntennasDigital Audio Broadcasting (DAB) Antennas (Satellite Radio)GPS & Hand-held RFID Reader AntennasAntennas in Hand-held RFID ReadersInformation provided by Arlon Materials for Electronics (MED).
Physical Properties Metric English Comments
Density 2.45 g/cc
0.0885 lb/in³
ASTM D792 Method A
Outgassing - Total Mass Loss 0.00 %

@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.00 %

@Pressure <=1.93e-8 psi,
Temperature 257 °F
Water Vapor Recovered; NASA SP-R-0022A
0.010 %

@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.010 %

@Pressure <=1.93e-8 psi,
Temperature 257 °F
Collected Volatiles; NASA SP-R-0022A
0.020 %

@Pressure <=1.33e-10 MPa,
Temperature 125 °C
0.020 %

@Pressure <=1.93e-8 psi,
Temperature 257 °F
NASA SP-R-0022A
Mechanical Properties Metric English Comments
Peel Strength 2.10 kN/m
12.0 pli
After Thermal Stress; IPC TM-650 2.4.8
Thermal Properties Metric English Comments
CTE, linear 10.0 µm/m-°C

@Temperature 0.000 - 100 °C
5.56 µin/in-°F

@Temperature 32.0 - 212 °F
y direction; IPC TM-650 2.4.24
11.0 µm/m-°C

@Temperature 0.000 - 100 °C
6.11 µin/in-°F

@Temperature 32.0 - 212 °F
x direction; IPC TM-650 2.4.24
CTE, linear, Transverse to Flow 45.0 µm/m-°C

@Temperature 0.000 - 100 °C
25.0 µin/in-°F

@Temperature 32.0 - 212 °F
z direction; IPC TM-650 2.4.24
Thermal Conductivity 0.460 W/m-K

@Temperature 100 °C
3.19 BTU-in/hr-ft²-°F

@Temperature 212 °F
ASTM E1225
Flammability, UL94 V-0
V-0
Vertical Burn
Electrical Properties Metric English Comments
Dielectric Constant 5.5

@Thickness 0.140 mm
5.5

@Thickness 0.00550 in
6.3

@Thickness 3.81 mm
6.3

@Thickness 0.150 in
6.15

@Thickness 0.381 mm,
Frequency 1.00e+6 Hz
6.15

@Thickness 0.0150 in,
Frequency 1.00e+6 Hz
C23/50; IPC TM-650 2.5.5.3
Dissipation Factor 0.0030

@Frequency 1.00e+6 Hz
0.0030

@Frequency 1.00e+6 Hz
C23/50; IPC TM-650 2.5.5.3
Arc Resistance >= 180 sec
>= 180 sec
D48/50; ASTM D495
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