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Aremco Aremco-Bond™ 860 Thermally Conductive Material, Aluminum Nitride Filled

Category Polymer , Adhesive , Thermoset , Epoxy
Manufacturer Aremco
Trade Name Aremco-Bond™
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aremco Aremco-Bond™ 860 Thermally Conductive Material, Aluminum Nitride Filled.pdf
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Material Notes:
Thermally Conductive, Aluminum Nitride Filled, 1:1 Epoxy Paste. Exceptional Mechanical and Thermal Properties to 400 ºF.
Physical Properties Metric English Comments
Specific Gravity 1.90 g/cc
1.90 g/cc
Viscosity 40000 cP
40000 cP
mixed
Mechanical Properties Metric English Comments
Hardness, Shore D 75.0
75.0
Shear Strength 9.480 MPa
1375 psi
Strength can be increased 40-50% by heat curing; ASTM D1002-94
Thermal Properties Metric English Comments
CTE, linear 34.2 µm/m-°C

@Temperature 20.0 °C
19.0 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 1.22 W/m-K
8.50 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 204 °C
400 °F
Minimum Service Temperature, Air -65.0 °C
-85.0 °F
Shrinkage 0.00200 %
0.00200 %
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+15 ohm-cm
1.00e+15 ohm-cm
Dielectric Strength 9.84 kV/mm
250 kV/in
Processing Properties Metric English Comments
Cure Time 120 min

@Temperature 93.3 °C
2.00 hour

@Temperature 200 °F
Recommended Cure
1440 - 2880 min

@Temperature 23.0 °C
24.0 - 48.0 hour

@Temperature 73.4 °F
Alternate Cure
Pot Life 240 min

@Temperature 25.0 °C
240 min

@Temperature 77.0 °F
100 gm mass
Descriptive Properties Value Comments
Chemical Resistance Excellent
Color Gray
Mix Ratio By Weight 1:1
resin:hardener
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