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Aptek DIS-A-PASTE 2003-A/B Thermally conductive urethane adhesive

Category Polymer , Adhesive , Thermoset , Polyurethane, TS , Thermoset Polyurethane, Adhesive
Manufacturer Aptek Laboratories
Trade Name DIS-A-PASTE
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek DIS-A-PASTE 2003-A/B Thermally conductive urethane adhesive.pdf
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Material Notes:
Long work life, thermally conductive urethane adhesive DIS-A-PASTE 2003-A/B is a two component, mineral filled, electrically insulating soft urethane paste adhesive. It is designed to bond many dissimilar substrates and dissipate device generated heat. DIS-A-PASTE 2003A/B is a 100% solid, solvent free system that will not form voids during cure or outgas after being cured. This product is a non-TDI based urethane system which has reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry.Low modulus/high elongation for minimum stress to sensitive components and ceramic substrates. Low Tg for excellent low temperature cycling and performance. Excellent substrate adhesion; superior to silicones. Exceeds NASA outgassing requirements for high vacuum environments. Bonds DAT-A-THERM 1000 film to devices and substrates without loss of thermal conductivity. Available in pre-mixed frozen syringes. Product also available in 8-10 mil. bondline spacers-designated DIS-A-PASTE 2003A-.010/B.DIS-A-PASTE 2003-A is an off-white, mineral filled polyol resin. DIS-A-PASTE 2003-B is a clear, organic isocyanate.Information provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 1.07 - 1.70 g/cc
0.0387 - 0.0614 lb/in³
B Component; ASTM D1475
2.08 - 2.18 g/cc
0.0751 - 0.0788 lb/in³
A Component; ASTM D1475
Viscosity 2700 cP
2700 cP
B Component; ASTM D1824
150000 cP
150000 cP
A Component; ASTM D1824
Outgassing - Total Mass Loss 0.27 %
0.27 %
Cured property; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material 0.0050 %
0.0050 %
Cured property; at 10E-6 torr; ASTM E595
Mechanical Properties Metric English Comments
Hardness, Shore A 80
80
Cured property; ASTM D2240
Tensile Strength, Ultimate 3.10 MPa
450 psi
Cured property; ASTM D638
Elongation at Break 90 %
90 %
Cured property; ASTM D638
Adhesive Bond Strength 1.79 MPa
260 psi
Al-to-Al Lap Shear; Cured property; ASTM D1002
Thermal Properties Metric English Comments
CTE, linear 31.0 µm/m-°C

@Temperature 20.0 °C
17.2 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 1
137 µm/m-°C

@Temperature 20.0 °C
76.1 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 2
Thermal Conductivity 0.744 W/m-K
5.16 BTU-in/hr-ft²-°F
Cured property; COLORA
Glass Transition Temp, Tg -60.0 °C
-76.0 °F
Cured property; JMTP P-200
Flash Point >= 150 °C
>= 302 °F
B Component; ASTM D92
>= 200 °C
>= 392 °F
A Component; ASTM D92
Electrical Properties Metric English Comments
Volume Resistivity 2.00e+14 ohm-cm
2.00e+14 ohm-cm
Cured property; ASTM D257
Dielectric Constant 5.4

@Frequency 1000 Hz
5.4

@Frequency 1000 Hz
Cured property; ASTM D150
Dielectric Strength 24.4 kV/mm

@Thickness 1.27 mm
620 kV/in

@Thickness 0.0500 in
Cured; ASTM D149
Dissipation Factor 0.016

@Frequency 1000 Hz
0.016

@Frequency 1000 Hz
Cured property; ASTM D150
Processing Properties Metric English Comments
Processing Temperature 85.0 °C
185 °F
Cure 6 hrs
100 °C
212 °F
Cure 4 hrs
125 °C
257 °F
Cure 2 hrs
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