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Aptek 6512-PMF Electronic grade, conductive epoxy adhesive

Category Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive , Epoxy, Electrically Conductive
Manufacturer Aptek Laboratories
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek 6512-PMF Electronic grade, conductive epoxy adhesive.pdf
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Material Notes:
APTEK 6512-PMF is a one component, 100% solid, silver-filled, electrically conductive epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards. APTEK 6512-PMF displays excellent adhesion to various metal, ceramic, and PC board substrates.Long RT pot life/snap heat cure - ideal for automated systems; High purity resin system for minimum level of ionic contamination to prevent corrosion problems; Smooth, highly thixotropic consistency for machine stamping and syringe dispensing applications. Holds its shape during heat cure for component staking applications; Capable of curing at 85ºC to minimize harming heat-sensitive components; Lower Tg version available for reworkable-grade adhesive for SMT; Available in various size syringes and alternative containers to meet application requirementsInformation provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 3.00 g/cc
0.108 lb/in³
ASTM D1475
Mechanical Properties Metric English Comments
Adhesive Bond Strength 6.89 MPa
1000 psi
Al-to-Al Lap Shear; Cured 30 min. at 125ºC, 3-5 mil bond line, Al to Al; ASTM D1002
Thermal Properties Metric English Comments
Flash Point >= 150 °C
>= 302 °F
ASTM D92
Electrical Properties Metric English Comments
Volume Resistivity 0.0050 ohm-cm
0.0050 ohm-cm
Cured property; ASTM D257
Processing Properties Metric English Comments
Processing Temperature 85.0 °C
185 °F
Cure 2 hrs
100 °C
212 °F
Cure 1 hrs
125 °C
257 °F
Cure 0.5 hrs
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