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Aptek 6505PMF Electronic-grade, non-conductive adhesive

Category Polymer , Adhesive , Thermoset
Manufacturer Aptek Laboratories
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek 6505PMF Electronic-grade, non-conductive adhesive.pdf
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Material Notes:
APTEK 6506-PMF is a one component, 100% solid, mineral-filled epoxy adhesive specifically designed for the attachment of electronic components to printed circuit boards as well as a protective barrier underneath epoxy overmolded devices. APTEK 6505-PMF displays excellent adhesion to various metal, ceramic, and PC board substrates.Long RT pot life/snap heat cure-ideal for automated systems; High purity resin system for minimum level of ionic contamination to prevent corrosion problems; Smooth, highly thixotropic consistency for machine stamping and syringe dispensing applications. Holds its shape during heat cure for component stacking applications; Capable of cure at 80ºC to minimize harmful heat-sensitive components; Changes colors when gelation occurs-takes the guess work out of knowing when the material is gelled; Lower Tg version available in various size syringes and alternative containers to meet application requirementsInformation provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 1.87 g/cc
0.0676 lb/in³
ASTM D1475
Viscosity 220000 cP
220000 cP
(#7spindle/10 rpm)
Mechanical Properties Metric English Comments
Hardness, Shore D 90
90
Cured property; ASTM D2240
Adhesive Bond Strength 13.8 MPa
2000 psi
Al-to-Al Lap Shear; Cured property; ASTM D1002
Thermal Properties Metric English Comments
Flash Point >= 150 °C
>= 302 °F
ASTM D92
Electrical Properties Metric English Comments
Volume Resistivity 2.50e+14 ohm-cm
2.50e+14 ohm-cm
Cured property; ASTM D257
Processing Properties Metric English Comments
Processing Temperature 80.0 °C
176 °F
Cure 1.5 hrs
100 °C
212 °F
Cure 0.75 hrs
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