Songhan Plastic Technology Co.,Ltd.
 POLYMER SEARCH

Aptek 6110-A/B Epoxy Encapsulant and/or Potting Compound

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer Aptek Laboratories
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek 6110-A/B Epoxy Encapsulant and/or Potting Compound.pdf
Price EMAIL US    sales@lookpolymers.com
  Online Service   lookpolymers   27660005
Material Notes:
Optoelectronic grade encapsulant/potting compound – will not attack/cloud polysulphone casings. More flexible, lower Tg version of APTEK 6106-A/B, for good temperature cycling in ceramic devices.Part A is pale yellow to pale blue. Part B is water clear.Information provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 0.940 g/cc
0.0340 lb/in³
B Component; ASTM D1475
1.15 g/cc
0.0415 lb/in³
A Component; ASTM D1475
Viscosity 65 cP
65 cP
B Component; Spindle #2; speed 100 rpm; ASTM D1824
3400 cP
3400 cP
A Component; Spindle #3; speed 10 rpm; ASTM D1824
Mechanical Properties Metric English Comments
Hardness, Shore D 85
85
Cured property; ASTM D2240
Thermal Properties Metric English Comments
Flash Point >= 100 °C
>= 212 °F
B Component; ASTM D92
>= 200 °C
>= 392 °F
A Component; ASTM D92
Electrical Properties Metric English Comments
Volume Resistivity >= 1.00e+15 ohm-cm
>= 1.00e+15 ohm-cm
Cured property; ASTM D257
Copyright © lookpolymers.com All Rights Reserved