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Aptek 2712-A/B Very low stress silicone adhesive

Category Polymer , Adhesive , Thermoset , Silicone , Silicone, RTV, Adhesive/Sealant Grade
Manufacturer Aptek Laboratories
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek 2712-A/B Very low stress silicone adhesive.pdf
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Material Notes:
Very low stress silicone adhesive; -110ºC to 260ºC operating range; Low outgassing/space gradeAPTEK 2712-A/B is a two component, white, very soft, thixotropic, electrically insulative, silicone adhesive displaying excellent flow temperature flexibility and unusually high physical strength properties. APTEK 2712-A/B has been designed to fully cure at room temperature and can be accelerated with a brief low temperature cure. This 100% solid system has been manufactured with highly pure resins to minimize the occurrence of ionic contamination without outgassing during cure or service.Very flexible/low modulus over wide temperature range to absorb stress build-up during thermal cycling; Convenient 1:1 PBW or PBV mix ratio for easy handling-ideal for cartridge dispensers/repair kits; Very good adhesion to various substrates when used in conjunction with APTEK P-107 primer; Long work life, short cure cycle options for improved productivity on large area bonding applications.APTEK 2712A is a white silica-filled silicone resin blend. APTEK 2712B is a translucent silica-filled silicone resin blend.Information provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 1.15 g/cc
0.0415 lb/in³
A Component; ASTM D1475
1.15 g/cc
0.0415 lb/in³
B Component; ASTM D1475
Outgassing - Total Mass Loss 0.55 %
0.55 %
at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material 0.050 %
0.050 %
at 10E-6 torr; ASTM E595
Mechanical Properties Metric English Comments
Hardness, Shore A 16
16
Cured property; ASTM D2240
Tensile Strength, Ultimate 4.14 MPa

@Thickness 1.47 mm
600 psi

@Thickness 0.0580 in
Cured; ASTM D638
Elongation at Break 700 %
700 %
Cured property; ASTM D638
Adhesive Bond Strength 2.76 MPa
400 psi
Al-to-Al Lap Shear; Cured property;5 mil bondline thickness on primed aluminum panels; ASTM D1002
Tear Strength 23.7 kN/m
135 pli
ASTM D624
Thermal Properties Metric English Comments
CTE, linear 54.0 µm/m-°C

@Temperature 20.0 °C
30.0 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 1
235 µm/m-°C

@Temperature 20.0 °C
131 µin/in-°F

@Temperature 68.0 °F
Cured property; alpha 2
Maximum Service Temperature, Air 260 °C
500 °F
Minimum Service Temperature, Air -110 °C
-166 °F
Glass Transition Temp, Tg -110 °C
-166 °F
Cured property; Perkin Elmer TMS-2
Flash Point >= 150 °C
>= 302 °F
A Component; ASTM D92
>= 150 °C
>= 302 °F
B Component; ASTM D92
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+15 ohm-cm
1.00e+15 ohm-cm
Cured property; ASTM D257
Dielectric Strength 13.8 kV/mm

@Thickness 6.35 mm
350 kV/in

@Thickness 0.250 in
Cured; ASTM D149
Processing Properties Metric English Comments
Processing Temperature 25.0 °C
77.0 °F
Cure Time not defined
65.0 °C
149 °F
Cure 1 hrs
100 °C
212 °F
Cure 0.5 hrs.
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