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Aptek 2120 PMF Low modulus urethane staking compound

Category Polymer , Adhesive , Thermoset , Polyurethane, TS , Thermoset Polyurethane, Adhesive
Manufacturer Aptek Laboratories
Trade Name
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Aptek 2120 PMF Low modulus urethane staking compound.pdf
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Material Notes:
Premixed-frozen, low modulus urethane staking compoundAPTEK 2120-PMF is a one component, premixed-frozen, thixotropic, electrically insulating soft urethane adhesive. It was designed for the staking of electrical/electronic components to printed circuit boards. APTEK 212-PMF is a 100% solids, solvent free system that will not form voids during cure or outgas after being fully cured. APTEK 2120-PMF is a non-TDI based urethane system which has outstanding reversion resistance and physical stability when subjected to high heat and humidity environments. As a urethane, this system displays higher ionic purity than epoxy systems minimizing the chance of corrosion around sensitive components and circuitry. Premixed-frozen and packaged in syringes for convenient dispensing to circuit board; Low modulus to minimize stress to sensitive components and ceramic substrates; Low Tg for excellent low temperature cycling and performance; Excellent substrate adhesion; superior to silicones. Information provided by Aptek Laboratories, Inc.
Physical Properties Metric English Comments
Density 0.980 g/cc
0.0354 lb/in³
ASTM D1475
Viscosity 188000 cP
188000 cP
ASTM D1824
Mechanical Properties Metric English Comments
Hardness, Shore A 63
63
Cured property; ASTM D2240
Thermal Properties Metric English Comments
Glass Transition Temp, Tg -60.0 °C
-76.0 °F
Cured property; JMTP P-200
Flash Point >= 150 °C
>= 302 °F
ASTM D92
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+15 ohm-cm
1.00e+15 ohm-cm
Cured property; ASTM D257
Dielectric Constant 3.5

@Frequency 1000 Hz
3.5

@Frequency 1000 Hz
Cured property; ASTM D150
Dielectric Strength >= 13.8 kV/mm

@Thickness 0.127 mm
>= 350 kV/in

@Thickness 0.00500 in
Cured; ASTM D149
Dissipation Factor 0.024

@Frequency 1000 Hz
0.024

@Frequency 1000 Hz
Cured property; ASTM D150
Processing Properties Metric English Comments
Processing Temperature 85.0 °C
185 °F
Cure 5 hrs
100 °C
212 °F
Cure 3 hrs
125 °C
257 °F
Cure 1.5 hrs
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