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- AIM 70In/30Pb Solder for Photonic Packaging
AIM 70In/30Pb Solder for Photonic Packaging
| Category | Metal , Nonferrous Metal , Indium Alloy , Solder/Braze Alloy |
| Manufacturer | AIM Specialty Materials |
| Trade Name | |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | AIM 70In/30Pb Solder for Photonic Packaging.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Uses include:Fiber to Ferrule SolderingLaser Die AttachHermetic Packaging & SealingWetting & Sealing Laser OpticsThermal ManagementInformation provided by AIM Specialty Materials.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 8.19 g/cc | 0.296 lb/in³ |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Strength, Ultimate | 164 MPa | 23800 psi |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 28.0 µm/m-°C @Temperature 20.0 °C |
15.6 µin/in-°F @Temperature 68.0 °F |
|
| Melting Point | 160 - 174 °C | 320 - 345 °F | |
| Solidus | 160 °C | 320 °F | |
| Liquidus | 174 °C | 345 °F |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Indium, In | 70 % | 70 % | |
| Lead, Pb | 30 % | 30 % |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Creep Resistance | Moderate |
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