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- Polymer Property : Volume Resistivity = 8.00e+14 ohm-cm
Polymer Property : Volume Resistivity = 8.00e+14 ohm-cm Product List
Electrical PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1112NC Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1112NC Black is a two part unfilled fast curing electronic grade epoxy encapsulant designed for small to medium sized castings. EP1112NC Black is a modified version of the standard EP11.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1320LV Heat Cure Epoxy Conformal Coating Resinlab™ EP1320 and EP1320LV are one part heat cure epoxy conformal coatings. They can also be used as a small mass potting compounds, structural adhesives, or insulating polymer systems where the.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1325 Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where .. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1325LV Thixotropic, Heat Curing Epoxy Adhesive Resinlab™ EP1325 and EP1325LV are one part thixotropic, heat curing epoxy adhesives. They can also be used as a small mass potting compounds, staking or damming adhesives, or polymer systems where .. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1330 Heat Cure Epoxy Polymer System Resinlab™ EP1330 and EP1330LV are one part heat cure epoxy polymer systems. They can also be used as a small mass potting or staking compounds, or a dam adhesive in and “dam and fill” application.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1330LV Heat Cure Epoxy Polymer System Resinlab™ EP1330 and EP1330LV are one part heat cure epoxy polymer systems. They can also be used as a small mass potting or staking compounds, or a dam adhesive in and “dam and fill” application.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1385 Black Epoxy Formulation Resinlab™ EP1385 Black is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to w.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1385 Clear Epoxy Formulation Resinlab™ EP1385 Clear is an epoxy formulation designed for applications requiring resistance to E-85 type fuels. It has good wetting and adhesion to most surfaces. It has very good resistance to w.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP691 Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP 691 Black is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP965LVLX Black Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has .. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | ASTM D257 |
| Techmer ES HiFill® PA6/6 GF/M40 B1 BK 40% Glass/Mineral Fiber Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 40% Filler by Weight and Mineral Filler, 40% Filler by WeightAdditive: LubricantFeatures: LubricatedAppearan.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | ASTM D257 |
| Techmer ES HiFill® PA6/6 GF/M40 IG BK 40% Glass/Mineral Fiber Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 40% Filler by Weight and Mineral Filler, 40% Filler by WeightAdditive: Lubricant and Heat StabilizerFeatures.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | ASTM D257 |
| Techmer ES HiFill® PA6/6 GF/M40 L BK 40% Glass/Mineral Fiber Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 40% Filler by Weight and Mineral Filler, 40% Filler by WeightAdditive: Lubricant and Heat StabilizerFeatures.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | ASTM D257 |
| Techmer ES HiFill® PA6/6 GF/M40 ML2 GY 40% Glass/Mineral Fiber Filled Availability: North AmericaForms: PelletsFiller/Reinforcement: Glass Fiber Reinforcement, 40% Filler by Weight and Mineral Filler, 40% Filler by WeightAdditive: Molybdenum Disulfide Lubricant and He.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | dry; IEC 60093 |
| DSM Novamid® 1010GN2-20 NAT/BK37 PA6-GF20 FR(17) 20% Glass Reinforced, Flame Retardant |
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| Volume Resistivity | 8.00e+14 ohm-cm @Temperature 20.0 °C |
8.00e+14 ohm-cm @Temperature 68.0 °F |
ASTM D257 |
| Fainplast Compounds HAX HF 018/15 Halogen Free PVC General purpose |
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| Volume Resistivity | 8.00e+14 ohm-cm @Temperature 23.0 °C |
8.00e+14 ohm-cm @Temperature 73.4 °F |
ASTM D257 |
| DuPont Performance Polymers Delrin® 111P NC010 Acetal Homopolymer Delrin® 111P is a high viscosity acetal homopolymer with improved thermal stability and modifications for more precise molding (reduced warpage, fewer voids). It has higher tensile strength and mod.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | C96/35/90; IPC TM-650 2.5.17.1 |
| Arlon CuClad 233 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 233 uses a medium fiberglass/PTFE ratio to balance lower dielectric constant and improved dissipation factor without sacrificing mechanical properties.Cross Plied Woven Fiberglass, alternatin.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1026 Clear Epoxy Adhesive Resinlab™ EP1026 Clear is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in .. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1026R Rubber Modified Epoxy Adhesive Resinlab™ EP1026R is a two part unfilled rubber modified epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free .. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1056LV Black Urethane Modified Epoxy Casting Resin Resinlab™ EP1056LV Black is a two part urethane modified epoxy casting resin designed to give good adhesion to metals and PVC. It has good wetting to most surfaces and is free-flowing to penetrate .. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP11HT Gray Filled Epoxy Adhesive Resinlab™ EP11HT Gray is a two part filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-rigid material. It has good wetting to most surfa.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP11HTFS Gray Filled Epoxy Adhesive Resinlab™ EP11HTFS Gray is a two part filled epoxy adhesive designed for bonding metals and plastics. It cures at room temperature to a tough, semi-rigid material. It has good wetting to most surfa.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP691 Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP691 is a two part unfilled electronic grade epoxy encapsulant designed for medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has good wetting and ad.. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP965LVLX Clear Unfilled Electronic Grade Epoxy Encapsulant Resinlab™ EP965LVLX Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures at room temperature to a tough, semi-rigid polymer. It has .. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1026 Black Epoxy Adhesive Resinlab™ EP1026 Black is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in .. |
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| Volume Resistivity | 8.00e+14 ohm-cm | 8.00e+14 ohm-cm | |
| Resinlab® EP1305 Black Highly Toughened Urethane Modified Epoxy Resinlab™ EP1305 Black is a highly toughened urethane modified epoxy designed for bonding PVC, metals, ceramics and other difficult to bond substrates. The system has a thixotropic non-sag viscosi.. |
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