Polymer Property : Volume Resistivity = 5.00e+11 ohm-cm Product List

Electrical Properties

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Electrical Properties	Metric	English	Comments
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm
Plastcom SLOVAMID 6 GF 30 006/1M PA6 reinforced with 30% glass fibre Features: PA 6 for injection moulding, chemically strengthened with 30% of milled glass fibre, for mouldings with high strength and toughness used in the automotive, electrical, engineering and cons..
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm
Plastcom SLOVAMID 6 GF 33 PA6, 33% glass fibre FeaturesPA 6 for injection moulding, chemically strengthened with 33% of glass fibre, for mouldings with high strength and toughness used in the automotive, electrical, engineering and consumer-good..
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm
Plastcom SLOVAMID 6 GF 50 LS PA6, 50% glass fibre, light stability FeaturesPA 6 for injection moulding, chemically strengthened with 50% of glass fibre, for mouldings with high strength and toughness used in the automotive, electrical, engineering and consumer-good..
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm
Plastcom SLOVAMID 6 GF 50 TS PA6, 50% glass fibre FeaturesPA 6 for injection moulding, chemically strengthened with 50% of glass fibre, for mouldings with high strength and toughness used in the automotive, electrical, engineering and consumer-good..
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm
Plastcom SLOVAMID 6/66 GF 50 PA6/66, 50% glass fibre FeaturesPA 6/66 for injection moulding, chemically strengthened with 50% of glass fibre, for mouldings with high strength and toughness used in the automotive, electrical, engineering and consumer-g..
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm
Shinil Chemical SHINSTAT PC Electrostatic Control Polymer Injection Grade SHINSTAT is an Inherently Dissipative Polymer (IDP) compound which can discharge the electrostatic charge (ESD) effectively. Shinil has designed SHINSTAT using Shinil's patented IDP technology for ..
Volume Resistivity	>= 5.00e+11 ohm-cm @Temperature 20.0 Â°C	>= 5.00e+11 ohm-cm @Temperature 68.0 Â°F
Sibur ONZ-40 Compound M-258 Polyvinyl Chloride (PVC) Shall correspond to control sample, approved in accordance with the established procedure. Pores, which can be seen by eyes, are not allowed. Plastic shall no burn at stop of worm extruder for a p..
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm	ASTM D257
Teknor Apex APEXÂ® 327 Polyvinyl Chloride, Flexible Notes: 60Â°C Insulation; RoHS Compliant Uses: Flexible Cord Insulation; Flexible Cord JacketingForms: Pellets Wire Types: SJT; SPT-1; SPT-2; SPT-3; SRDT; ST; SVT Agency Ratings: UL 1581; UL 62 Pro..
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm	50% RH; ASTM D257
Lubrizol Stat-Rite® X-5076 Static Control High Impact Polystyrene Stat-Rite® X-5076 is a static dissipative, High Impact Polystyrene alloy. Stat-Rite® X-5076 utilizes the patented Stat-Rite® inherently dissipative polymer (IDP) alloy system to provide clean, p..
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm	IEC 60093
Unitika A3130 PA6, 35% Mineral Reinforced, Conditioned Information provided by Unitika Ltd.
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm
Tra-Con Tra-Bond F125 Fast Gel Clear Epoxy Adhesive TRA-BOND F125 is a 10 minute gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. This clear, two part system is easily mixed and used at room te..
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm
Tra-Con Tra-Bond 2106 Fast Cure, Medium Viscosity Epoxy Adhesive TRA-BOND 2106 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. This clear, two-part, medium viscosity syste..
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm
Tra-Con Tra-Bond 2106T Fast Cure Thixotropic Epoxy Adhesive TRA-BOND 2106T is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. This versatile two-part epoxy system contai..
Volume Resistivity	>= 5.00e+11 ohm-cm	>= 5.00e+11 ohm-cm
Epoxy Technology EPO-TEK® M10-D Epoxy Paste Material Description: A single component, B-stageable epoxy paste for semiconductor, microelectronics, and optical assemblies. It can be used in hybrid assemblies for lid-sealing and substrate atta..
Volume Resistivity	5.00e+11 ohm-cm @Temperature 60.0 °C	5.00e+11 ohm-cm @Temperature 140 °F	IEC 60093
BASF Ultramid® KR 4355 G7 35% Glass Filled PA6/6T (Conditioned) Description: 35% glass-fiber reinforced product for injection-molding; high toughness, strength and stiffness, low water absorption, high melting point (295°C [563°F]). The mechanical properties r..
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm
Atom Adhesives AA-BOND 201 Epoxy Adhesive AA-BOND 201 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where FAST CURING is required. AA-BOND 201 is versatile two-part epoxy system..
Volume Resistivity	5.00e+11 ohm-cm	5.00e+11 ohm-cm
Atom Adhesives AA-BOND F125 Epoxy Adhesive AA-BOND F125 is a 8 minutes gelling epoxy recommended for use in fiber optic connectors, optical and industrial bonding applications. AA-BOND F125 is clear, two part system is easily mixed and used ..