Polymer Property : Volume Resistivity = 4.20e+15 ohm-cm Product List

Electrical Properties

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Electrical Properties	Metric	English	Comments
Volume Resistivity	4.20e+15 ohm-cm	4.20e+15 ohm-cm	ASTM D 257
SABIC Innovative Plastics Geloy XTPM307 ASA+PC (Europe-Africa-Middle East) XTPM307 is a high heat resistant PC/ASA with improved processing stability over HRA150. Typical values measured on natural material.This data was supplied by SABIC-IP for the Europe-Africa-Middle Ea..
Volume Resistivity	4.20e+15 ohm-cm	4.20e+15 ohm-cm	ASTM D257
SABIC Innovative Plastics NORYL WCD841U PPE-TPE (Europe-Africa-Middle East) Flexible, UV stabilized, halogen free extrusion grade for applications such as wire insulation and cable jacket. Good color stability after UV weathering per ASTM D4459. Light color capable. Flame r..
Volume Resistivity	4.20e+15 ohm-cm	4.20e+15 ohm-cm	ASTM D257
SABIC Innovative Plastics NORYL WCD841U PPE-TPE Flexible, UV stabilized, halogen free extrusion grade for applications such as wire insulation and cable jacket. Good color stability after UV weathering per ASTM D4459. Light color capable. Flame r..
Volume Resistivity	4.20e+15 ohm-cm	4.20e+15 ohm-cm	ASTM D257
SABIC Innovative Plastics NORYL WCD841U PPE-TPE (Asia Pacific) Flexible, UV stabilized, halogen free extrusion grade for applications such as wire insulation and cable jacket. Good color stability after UV weathering per ASTM D4459. Light color capable. Flame r..
Volume Resistivity	4.20e+15 ohm-cm	4.20e+15 ohm-cm
Loctite® 3533 Low viscosity fill encapsulant Fill Encapsulant COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants imp..
Volume Resistivity	<= 4.20e+15 ohm-cm	<= 4.20e+15 ohm-cm
Cytec (Conap) RN-1200 / EA-87 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Volume Resistivity	<= 4.20e+15 ohm-cm	<= 4.20e+15 ohm-cm
Cytec (Conap) RN-1210 / EA-87 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Volume Resistivity	4.20e+15 ohm-cm	4.20e+15 ohm-cm	ASTM D257-07
CIP Composites 100 Series Laminated Polymer Bearing Material The 100 series consists of polyester fabric and one of several solid lubricants (optional) in a resin matrix. Non-metallic, high load, high impact and self lubricating laminated material. Laminated..