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Polymer Property : Volume Resistivity = 1.40e+14 ohm-cm Product List

Electrical Properties

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Electrical Properties Metric English Comments
Volume Resistivity 1.40e+14 ohm-cm
1.40e+14 ohm-cm
Tra-Con Tra-Bond 224-1 Rapid Room Temperature Cure Epoxy Adhesive
TRA-BOND 224-1 room temperature curing epoxy adhesive develops structural strength rapidly. Unlike most "rapid cure" epoxies which gel in one or two minutes, TRA-BOND 224-1 adhesive exhibits a 30 mi..
Volume Resistivity 1.40e+14 ohm-cm
1.40e+14 ohm-cm
Tra-Con Tra-Cast 3101 Encapsulating Adhesive System
TRA-CAST 3101 is an easy-to-use, room temperature cure, rigid, low viscosity, 100% solids (no solvents) epoxy resin and hardener system with excellent mechanical and electrical properties. It is rec..
Volume Resistivity 1.40e+14 ohm-cm
1.40e+14 ohm-cm
E24/125; IPC TM-650 2.5.17.1
Arlon 85NT Polyimide Nonwoven Aramid Laminate and Prepreg
85NT is a pure polyimide laminate and prepreg system (Tg = 250°C), reinforced with a non-woven aramid substrate. This system combines the high-reliability features of polyimide (improved PTH relia..
Volume Resistivity 1.40e+14 ohm-cm
1.40e+14 ohm-cm
C96/35/90; IPC TM-650 2.5.17.1
Arlon CLTE-P Pre-Preg Bonding Layer
Arlon's CLTE-P Prepreg Bonding Layer is a ceramic filled PTFE coated glass stock that is used as a bonding ply for CLTE, CLTE-X or CLTE-AT laminates. CLTE-P is a pre-preg material that consists of ..
Volume Resistivity 1.40e+14 ohm-cm
1.40e+14 ohm-cm
C96/35/90; IPC TM-650 2.5.17.1
Arlon MULTICLAD™ HF Halogen-Free Low-Loss Laminate and Prepreg System
MULTICLAD™ HF represents the next generation low-loss thermoset and prepreg system for high-speed and high-frequency printed circuit boards. This technology combines a low-loss, high reliability t..
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