Electrical Properties | Metric | English | Comments |
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Dielectric Strength | 53.1 kV/mm | 1350 kV/in | IPC-TM-650.2.5.6.2 |
Park Electrochemical Nelco® N7000-1 Polyimide Laminate and Prepreg The Nelco N7000-1 series of polyimide laminate and prepreg has alow Z-axis expansion and high Tg offering PCB manufacturers consistent board performance and reliability. N7000-1 is a good choice for.. |
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Dielectric Strength | 53.0 kV/mm | 1350 kV/in | IEC 243 |
LG Chemical LG-749 ABS, Low Gloss, High Heat Resistance Information Provided by LG Chem |
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Dielectric Strength | 53.0 kV/mm | 1350 kV/in | |
Momentive Performance Materials HBN Hot-Pressed Boron Nitride Hot-pressed BN is compacted at temperatures up to 2000°C and pressures up to 2000 psi to form a dense, strong engineering material that is easily machined. It is available in standard and custom.. |
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Dielectric Strength | 53.0 kV/mm | 1350 kV/in | |
Momentive Performance Materials HBR Hot-Pressed Boron Nitride Hot-pressed BN is compacted at temperatures up to 2000°C and pressures up to 2000 psi to form a dense, strong engineering material that is easily machined. It is available in standard and custom.. |
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Dielectric Strength | 53.0 kV/mm | 1350 kV/in | ASTM D149 |
Westlake Plastics Norylux™ Modified Polyphenylene Oxide 30% glass filled Norylux modified PPO is a strong, engineering plastic with outstanding mechanical, thermal, and electric properties. Low moisture absorption and low thermal expansion make Norylux one of the most d.. |
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Dielectric Strength | 53.1 kV/mm | 1350 kV/in | ASTM D149 |
Arlon Thermabond® 48991A010 0.010" (0.254 mm) Uncured Silicone Rubber with Fiberglass Substrate Description: Generation IIa Thermabond® NP electrically insulating electronic adhesive. Bonds without primer.Design/Construction: Liner: PolyethyleneSide 1: Uncured Silicone RubberSubstrate: Style .. |
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Dielectric Strength | 53.1 kV/mm | 1350 kV/in | ASTM D149 |
Arlon R36601A010 0.010" (0.254 mm) Uncured Silicone Rubber with Fiberglass Substrate Description: Generation II Thermabond® NP electrically insulating electronic adhesive. Bonds without primer.Design/Construction: Liner 1: Polyethylene Side 1: Uncured Silicone Rubber Substrate: Sty.. |