Electrical Properties | Metric | English | Comments |
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Surface Resistance | <= 0.010 ohm @Temperature 85.0 °C, Time 605000 sec |
<= 0.010 ohm @Temperature 185 °F, Time 168 hour |
(SR); CHO-TP-57 |
Parker Chomerics CHO-FOIL CCH Shielding Tape Conductive Adhesive Copper FoilDescription: Chomerics’ CHO-FOIL® tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or ti.. |
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Surface Resistance | <= 0.010 ohm @Temperature 121 °C, Time 605000 sec |
<= 0.010 ohm @Temperature 250 °F, Time 168 hour |
(SR); CHO-TP-57 |
Parker Chomerics CHO-FOIL CCH Shielding Tape Conductive Adhesive Copper FoilDescription: Chomerics’ CHO-FOIL® tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or ti.. |
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Surface Resistance | <= 0.010 ohm | <= 0.010 ohm | |
Parker Chomerics Tecknit Teckfip™ FIP-C (SP) Formed in Place Conductive Elastomer Description: This is the small particle version of the FIP-C compound. It was specifically designed for mobile cell phone applications, which require a high degree of EMI shielding. While the compou.. |
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Surface Resistance | <= 0.010 ohm | <= 0.010 ohm | |
Parker Chomerics Tecknit Teckfip™ FIP-C Formed in Place Conductive Elastomer Description: This compound is an all round high performance compound, and is very similar to a Consil C molded or extruded elastomer. It has been traditionally used for telecommunications base stati.. |
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Surface Resistance | <= 0.010 ohm | <= 0.010 ohm | |
Parker Chomerics Tecknit Teckfip™ HC FIP-C Formed in Place Conductive Elastomer Description: Heat cure compound. This compound is an all round high performance compound, and is very similar to a Consil C molded or extruded elastomer. It has been traditionally used for telecommu.. |
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Surface Resistance | <= 0.010 ohm | <= 0.010 ohm | |
Parker Chomerics Tecknit Teckfip™ HC FIP-E Formed in Place Conductive Elastomer Heat cure compound. Commercial grade FIP compound designed for moderate shielding performance. The Ag/glass particles are very smooth which leads to very low compression set value.Information provid.. |
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Surface Resistance | <= 0.010 ohm @Temperature 121 °C, Time 605000 sec |
<= 0.010 ohm @Temperature 250 °F, Time 168 hour |
(TR); CHO-TP-57 |
Parker Chomerics CHO-FOIL CAD Shielding Tape Conductive Adhesive Aluminum FoilDescription: Chomerics’ CHO-FOIL® tapes are an economical EMI shielding solution for a variety of commercial uses. The tapes are available in copper, aluminum, or .. |