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Polymer Property : Shelf Life = 12.0 Month Product List

Processing Properties

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Processing Properties Metric English Comments
Shelf Life 12.0 Month

@Temperature 21.0 °C
12.0 Month

@Temperature 69.8 °F
Bi-Paks; from date of Manufacture
Parker Chomerics CHO-BOND 584-208 Conductive Adhesive
Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the m..
Shelf Life 12.0 Month

@Temperature 21.0 °C
12.0 Month

@Temperature 69.8 °F
Bi-Paks; From date of manufacture
Parker Chomerics CHO-BOND 584-29 Conductive Adhesive
Two-component, highly conductive adhesive system that combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the m..
Shelf Life 12.0 Month

@Temperature 21.0 - 27.0 °C
12.0 Month

@Temperature 69.8 - 80.6 °F
Lord Adhesives 320 / 322 Epoxy Adhesive
LORD® 320/322 adhesive is a general purpose, two component epoxy adhesive system formulated for primerless adhesion to automotive sheet molded compounds (SMC). This adhesive system also provides ..
Shelf Life 12.0 Month

@Temperature 21.0 - 27.0 °C
12.0 Month

@Temperature 69.8 - 80.6 °F
Lord Adhesives 320 / 322 Epoxy Adhesive
LORD® 320/322 adhesive is a general purpose, two component epoxy adhesive system formulated for primerless adhesion to automotive sheet molded compounds (SMC). This adhesive system also provides ..
Shelf Life 12.0 Month

@Temperature 21.0 - 27.0 °C
12.0 Month

@Temperature 69.8 - 80.6 °F
7000 Adhesive
Lord Adhesives Flocklok® 7000/7204 Flock Adhesive
LORD Flocklok® 7000/7204 adhesive is a two-part, single-coat adhesive used for adhering polyester or nylon flock fibers to a variety of thermoplastics, including PVC, Alcryn®, Sunprene®, ny..
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
309-2D Hardener
Lord Adhesives Fusor® 309-1D / 309-2D Epoxy Adhesive
Lord® 309 is a high performance, thixotropic, two-part epoxy adhesive that is used for applications that require gap filling or non-slumping characteristics on a vertical substrate. The cured adh..
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
310A Resin
Lord Adhesives Fusor® 310 A/B Epoxy Adhesive
Lord® 310 adhesive is a modified, thixotropic, two-part epoxy adhesive which bonds well to many types of prepared metals, prepared rubber, urethane, and plastics. Originally formulated for primer..
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Hardener
Lord Adhesives Thermosetâ„¢ EP-830 Ignition Coil Impregnating and Encapsulation Epoxy
Lord EP-830 is a heat curing, two component epoxy formulation designed especially for use in automotive high voltage ignition coils where adhesion to segmented bobbins is critical. The combination o..
Shelf Life 12.0 Month

@Temperature 4.00 °C
12.0 Month

@Temperature 39.2 °F
Lord Adhesives Thermosetâ„¢ MD-130 Electrically Insulating Die-Attach Adhesive
Lord MD-130 is a microelectronic grade, die-attach adhesive system for use in applications where electrical conductivity is not required. This system offers long, room temperature stability, fast cu..
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
Hardener
Lord Adhesives Thermosetâ„¢ MD-200 Electrically Conductive Die-Attach Adhesive
This is a system with the versatility to fit a wide variety of production and performance needs. The working life allows sufficient time for short production interruption. It can be initially cured ..
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
In Kits
Tra-Con Tra-Bond 224-1 Rapid Room Temperature Cure Epoxy Adhesive
TRA-BOND 224-1 room temperature curing epoxy adhesive develops structural strength rapidly. Unlike most "rapid cure" epoxies which gel in one or two minutes, TRA-BOND 224-1 adhesive exhibits a 30 mi..
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
PMF
Tra-Con Tra-Bond 224-1 Rapid Room Temperature Cure Epoxy Adhesive
TRA-BOND 224-1 room temperature curing epoxy adhesive develops structural strength rapidly. Unlike most "rapid cure" epoxies which gel in one or two minutes, TRA-BOND 224-1 adhesive exhibits a 30 mi..
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
In Kits
Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive
TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se..
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
PMF
Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive
TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se..
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
In Kits
Tra-Con Tra-Bond 293-1M General Purpose Instrument Epoxy Adhesive
TRA-BOND 293-1M general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. The 293-se..
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
PMF
Tra-Con Tra-Bond 293-1M General Purpose Instrument Epoxy Adhesive
TRA-BOND 293-1M general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. The 293-se..
Shelf Life 12.0 Month

@Temperature 25.0 °C
12.0 Month

@Temperature 77.0 °F
In Kits
Tra-Con Tra-Bond 342-3.5 Room Temperature Cure Epoxy Adhesive
TRA-BOND 342-3.5 room temperature curing epoxy adhesive is designed for applications which require outstanding thermal shock properties. This adhesive may be used to bond semi-porous materials such ..
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
PMF
Tra-Con Tra-Bond 342-3.5 Room Temperature Cure Epoxy Adhesive
TRA-BOND 342-3.5 room temperature curing epoxy adhesive is designed for applications which require outstanding thermal shock properties. This adhesive may be used to bond semi-porous materials such ..
Shelf Life 12.0 Month

@Temperature -18.0 °C
12.0 Month

@Temperature -0.400 °F
Hexcel® HexPly® 8551-7 Epoxy Matrix, Carbon Tape Form
Information provided by HexCel
Shelf Life 12.0 Month

@Temperature -18.0 °C
12.0 Month

@Temperature -0.400 °F
Guaranteed
Hexcel® HexPly® M14 248°F (120°C) Curing Epoxy Matrix
HexPly® M14 is a modified epoxy resin which provides good adhesion to honeycomb and foam cores. Its self-extinguishing characteristics meet the fire, smoke, and toxicity requirements of aerospace a..
Shelf Life 12.0 Month

@Temperature -18.0 °C
12.0 Month

@Temperature -0.400 °F
Hexcel® HexPly® M27 248°F (120°C) Curing Epoxy Matrix
HexPly® M27 is specifically designed for applications with fast curing cycles. It is ideally suited for high volume production techniques-in particular for ski manufacture. HexPly® M27 has been sp..
Shelf Life 12.0 Month

@Temperature -18.0 °C
12.0 Month

@Temperature -0.400 °F
Hexcel® HexPly® M39-X7B Epoxy Matrix
HexPly® M39-X7B is specifically designed for prepreg applications with unidirectional fibers and short curing cycles for sporting (e.g. racket production) and industrial applications. HexPly® M39-..
Shelf Life 12.0 Month

@Temperature 23.0 °C
12.0 Month

@Temperature 73.4 °F
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also ..
Shelf Life 12.0 Month

@Temperature -40.0 °C
12.0 Month

@Temperature -40.0 °F
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy
Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also ..
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