Polymer Property : Gel Time = 5.00 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Gel Time	5.00 - 12.0 min	5.00 - 12.0 min
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, 12K PW HTS Reinforced Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois..
Gel Time	5.00 - 12.0 min	5.00 - 12.0 min
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, 3K PW G30-500 Reinforced Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois..
Gel Time	5.00 - 12.0 min	5.00 - 12.0 min
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, 6K 5HS 630-500 Reinforced Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois..
Gel Time	5.00 - 12.0 min	5.00 - 12.0 min
Park Electrochemical Nelcote® E-752 Epoxy Prepreg, IM7 Unitape Reinforced Nelcote® E-752 is a toughened, 185°C cure epoxy system designed for demanding structural applications up to 130°C. E-752 offers a good balance of toughness, high service temperature and good mois..
Gel Time	5.00 min @Temperature 135 °C	5.00 min @Temperature 275 °F
Park Electrochemical Nelcote® E-765 Epoxy Prepreg, 7781 E-Glass Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request...
Gel Time	5.00 min @Temperature 135 °C	5.00 min @Temperature 275 °F
Park Electrochemical Nelcote® E-765 Epoxy Prepreg, T300 3K PW Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request...
Gel Time	5.00 min @Temperature 135 °C	5.00 min @Temperature 275 °F
Park Electrochemical Nelcote® E-765 Epoxy Prepreg, T300 6K 5HS Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request...
Gel Time	5.00 min @Temperature 135 °C	5.00 min @Temperature 275 °F
Park Electrochemical Nelcote® E-765 Epoxy Prepreg, T700 Uni Tape Reinforced Nelcote® E-765 is a tough 250°F cure prepreg system designed to replace 350°F cure systems in aircraft structural applications. FAA-approved Design Allowable Databases are available upon request...
Gel Time	5.00 - 10.0 min	5.00 - 10.0 min
Resin Technology Group 24N Two component Polyurethane Adhesive Resin Technology Group 24N Two component Polyurethane AdhesiveHigh impact, polycarbonate and PVC bonding urethane
Gel Time	5.00 min @Temperature 150 Â°C	5.00 min @Temperature 302 Â°F
Lord Adhesives Circalokâ„¢ EP-729 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ EP-729 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.All information provided by..
Gel Time	5.00 min @Temperature 150 Â°C	5.00 min @Temperature 302 Â°F
Lord Adhesives Thermosetâ„¢ ME-525 Underfill Encapsulant LORD Thermosetâ„¢ ME-525 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and wit..
Gel Time	5.00 - 11.0 min @Temperature 121 °C	5.00 - 11.0 min @Temperature 250 °F
Hexcel® HexPly® F185 Epoxy Resin HexPly® F185 is an advanced epoxy formulation designed for autoclave curing to offer very high sandwich and metal bonding strengths with moderate laminate strengths. HexPly® F185 is a structural a..
Gel Time	5.00 - 8.00 min @Temperature 177 °C	5.00 - 8.00 min @Temperature 351 °F
Hexcel® HexPly® F650 Bismaleimide Resin HexPly® F650 is a bismaleimide resin that cures via an additional/free radical mechanism resulting in a cross-linked thermoset system with no condensation by-products. HexPly® F650 was developed b..
Gel Time	5.00 min	5.00 min
ACC SMP™ EP 3001 EPI Engineered Polymers Silicone Modified Polymer EP 3001, “Powered by Reactamine® Technology”, is a two component 100% solid polyurea based sealant. EP 3001 is a self-leveling sealant designed to protect horizontal concrete. This elastomer disp..
Gel Time	5.00 min @Thickness 1.27 mm	5.00 min @Thickness 0.0500 in
Abatron AboCast 8101-5/AboCure 8101-5 5-Minute Epoxy AboCast 8101-5/AboCure 8101-5 is a very-fast-hardening 2-component epoxy adhesive, casting, and patching compound. It is a thixotropic (Vaseline-like consistency) form of the 8012-9 System. It is tr..
Gel Time	5.00 min @Thickness 1.27 mm	5.00 min @Thickness 0.0500 in
Abatron AboCast 8503-10/AboCure 8503-10 5-Minute Epoxy AboCast 8503-10/AboCure 8503-10 is a very-fast-hardening 2-component epoxy adhesive, casting, and patching compound. It is the toughest, most machineable, 5-minute metal-filled putty available. It h..
Gel Time	5.00 min @Thickness 1.27 mm	5.00 min @Thickness 0.0500 in
Abatron AboCast 8503-9/AboCure 8503-9 5-Minute Epoxy AboCast 8503-9/AboCure 8503-9 is a very-fast-hardening 2-component epoxy adhesive, casting, and patching compound. It is a neutral-buff colored, non-sag, mineral-filled putty to be applied with trow..
Gel Time	5.00 min	5.00 min	1:1
ACC EP JS EPI Engineered Polymers Joint Sealant EP JS Joint Sealant JS, “Powered by Reactamine® Technology” is a two component 100% solid (silicone optional) polyurea based joint sealant. EP JS is a self-leveling joint sealant designed to prot..