Polymer Property : Cure Time = 1.00 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	<= 1.00 min	<= 0.0167 hour	on metal (Fixture)
ND Industries 600 Methacrylate Resin Activator Activator for structural Adhesives and anaerobics. Solvent free.
Cure Time	<= 1.00 min	<= 0.0167 hour	With Primer (Fixture)
ND Industries NutGrade® 122 Removable Threadlocker A medium strength, oil tolerant threadlocker. Seals most types of nuts and bolts allowing disassembly using standard tools.Typical Usesstuds and bolts, threaded pipe fittings, and locking nuts or b..
Cure Time	1.00 - 30200 min	0.0167 - 504 hour	Average value: 3380 min Grade Count:18
Overview of materials for Epoxy, Cast, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Cast, Unreinforced". Each property range of values reported is minimum and maximum values of appr..
Cure Time	1.00 - 10100 min	0.0167 - 168 hour	Average value: 1950 min Grade Count:63
Overview of materials for Epoxy, Electrically Conductive This property data is a summary of similar materials in the MatWeb database for the category "Epoxy, Electrically Conductive". Each property range of values reported is minimum and maximum values of..
Cure Time	1.00 - 3.00 min @Temperature 204 - 260 Â°C	0.0167 - 0.0500 hour @Temperature 399 - 500 Â°F
Lord Adhesives FlocklokÂ® 550P Flock Adhesive LORD FlocklokÂ® 550P adhesive is a single-coat adhesive used to adhere polyester or nylon flock fibers to a variety of uncured and semi-cured elastomers including EPDM, NR, CR and SBR. Flocked sub..
Cure Time	1.00 min	0.0167 hour	Fixture time
ITW Devcon One minuteâ„¢ Epoxy Gel, Amber Information provided by ITW Devcon
Cure Time	1.00 - 3.00 min @Temperature 140 - 160 Â°C	0.0167 - 0.0500 hour @Temperature 284 - 320 Â°F
Lucite International Colacryl Â® TS1631 Acrylic Solution Resin Acrylic copolymer with reactive groupsA highly flexible resin with good handle. It exhibits good adhesion, resistance to ageing and light stability.Suggested Use: Coating and lamination of nylon and..
Cure Time	1.00 min	0.0167 hour	Tack Free Time
Shin-Etsu Silicones KE-348 Silicone, RTV Information Provided by Shin-Etsu Silicones of America, Inc.
Cure Time	1.00 min	0.0167 hour	At 30 mW/cm2
Tra-Con Tra-Bond 546S02 Low Viscosity UV Curable Adhesive TRA-BOND 546S02 is a low viscosity UV curable adhesive exhibiting exceptional adhesion to glass. TRA-BOND 546S02 is designed to be semi-flexible resulting in stress free bonds to glass and other sub..
Cure Time	1.00 min	0.0167 hour	60 sec. @ 180ºC under 200 psi load
Loctite® 3440 1 component Gold/polymer filler Anisotropic Epoxy Adhesive Electrically Conductive Bonding and Encapsulants and UnderfillsLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a ..
Cure Time	1.00 min	0.0167 hour	60 sec. @ 180ºC under 100 psi load
Loctite® 3445 1 component fusible solder filler Anisotropic Epoxy Adhesive Electrically Conductive Bonding and Encapsulants and UnderfillsLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a ..
Cure Time	1.00 min	0.0167 hour
Loctite® 392 Rapid Fixture Structural Adhesive Acrylic Bonding AdhesivesLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impact, stress and shock resistance. ..
Cure Time	1.00 min	0.0167 hour	UV Full Cure in 60 seconds at 75 mW/cm^2
Loctite® 5072 Silicone Chip Coating Conformal CoatingsConformal coatings are thin dielectric coatings that extend the longevity of circuit boards by protecting components and traces from corrosion, shorts, and mechanical damage. Locti..
Cure Time	1.00 min	0.0167 hour	Dry Time
Loctite® 7113 Heptane Base Accelerator Surface PreparersLoctite offers a complete line of surface preparation products to ensure the maximum performance of Loctite® Adhesives and Sealants.Loctite® Accelerators are used to increase the ..
Cure Time	1.00 min	0.0167 hour
Loctite® SpeedBonder™ 326 Fast Fixture Acrylic Bonding Adhesive Acrylic Bonding AdhesivesLoctite® Acrylic Adhesives were developed for bonding applications that require tensile, shear and peel strength combined with maximum impact, stress and shock resistance. ..
Cure Time	1.00 min @Temperature 150 °C	0.0167 hour @Temperature 302 °F
Dow Corning SR-7010 Two-part, hard, clear LED resin with a high refractive index and excellent light transparency, for molding fabricated parts.Information provided by Dow Corning
Cure Time	1.00 - 6.00 min	0.0167 - 0.100 hour	ts2; ASTM D2084
ExxonMobil Exxon™ 2244 Fast Cure Rate Grade Exxon Bromobutyl is a brominated copolymer of isobutylene and isoprene. The product form is offwhite to amber bales.Information provided by ExxonMobil Chemical
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-30 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-32 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-33 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-34 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-37 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 3.00 min	0.0167 - 0.0500 hour	Setting Time
Chosun Refractories HSM-38 Heat-Setting Mortar Information provided by Chosun Refractories via Korea Institute of Ceramic Engineering and Technology (KICET).
Cure Time	1.00 - 1.17 min	0.0167 - 0.0194 hour	per mm
Amity Thermosets ATS 134 Phenolic Molding Inorganic, graphite Filler, Compression Molded Characteristics: Low coefficient of frictionSelf lubricating ( graphite modified )Good thermal conductivityGood glide propertiesNot suitable for electrical applicationColor- black gray Soft/medium f..
Cure Time	1.00 min	0.0167 hour	Tack-free
3M FIP 1-Step Fire Barrier Rated Foam 3M Fire Barrier Rated Foam (FIP 1-Step), is a smoke, sound, and firestopping foam for wall and floor penetrations. Premium two-part, easy-to-handle formulations. Expands up to five times during inst..
Cure Time	1.00 - 1.50 min @Temperature 150 °C	0.0167 - 0.0250 hour @Temperature 302 °F
Loctite® CHIPBONDER® 3615 High Adhesion, Syringe Dispense Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application te..
Cure Time	1.00 - 1.50 min @Temperature 150 °C	0.0167 - 0.0250 hour @Temperature 302 °F
Loctite® CHIPBONDER® 3618 High Speed, Syringe Dispense Surface Mount AdhesivesLoctite® Chipbonder® Surface Mount Adhesives (SMAs) maintain component positioning during wave solder and solder reflow processes. Loctite offers a variety of application te..
Cure Time	1.00 min	0.0167 hour	at 40 mW/cm^2
Loctite® Nuva-Sil® 5088 Potting Compound Potters and Silicon Light Cure AdhesivesLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and sho..
Cure Time	1.00 min	0.0167 hour	at 40 mW/cm^2
Loctite® Nuva-Sil® 5091 High Adhesion Potting Potters and Silicon Light Cure AdhesivesLoctite® Potting materials are used on electronic device housings to enhance mechanical strength, provide electrical insulation and enhance vibration and sho..