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Polymer Property : Cure Time = 0.0167 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 0.500 - 1.00 min
0.00833 - 0.0167 hour
On Steel (Fixture)
ND Industries 388 Toughened Instant Superglue
Black toughened Cyanoacrylate for metal, rubber, and plastic
Cure Time 0.583 - 1.00 min
0.00972 - 0.0167 hour
On Steel (Fixture)
ND Industries High Temperature SuperGlue 311
Very high viscosity with thermal cycling resistance
Cure Time 0.417 - 1.00 min
0.00694 - 0.0167 hour
On Steel (Fixture)
ND Industries High Temperature SuperGlue 362
Medium viscosity with thermal cycling resistance
Cure Time 0.417 - 1.00 min
0.00694 - 0.0167 hour
On Steel (Fixture)
ND Industries SuperGlue Ethyl 316
Medium-high viscosity for gap fillingMeets military spec Mil-A-46050C Type II Class III
Cure Time 0.417 - 1.00 min
0.00694 - 0.0167 hour
On Steel (Fixture)
ND Industries SuperGlue Ethyl 322
High viscosity for large gap filling non-metallic surfacesMeets military spec Mil-A-46050C Type II Class III
Cure Time 0.333 - 1.00 min
0.00556 - 0.0167 hour
On Steel (Fixture)
ND Industries SuperGlue Ethyl 344
Medium viscosity, general purposeMeets military spec Mil-A-46050C Type II Class III
Cure Time 0.333 - 1.00 min
0.00556 - 0.0167 hour
With Excel 600392 primer (Fixture)
ND Industries 240 Structural Adhesive
Excellent impact and solvent resistance
Cure Time 0.500 - 1.00 min
0.00833 - 0.0167 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ EP 8414 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage  (dis
Epoxy molding compound, inorganically filled, glass fiber reinforced, highly heat resistant, good electrical even at higher temperatures, very slight post shrinkage, increased media resistance, UL l..
Cure Time 0.833 - 1.00 min
0.0139 - 0.0167 hour
per mm
Amity Thermosets ATO 156 Phenolic Molding Glass Filler, Compression Molded
Characteristics:High electrical insulationHigh mechanical strengthDimensional stabilityLow water absorptionColor-black Medium flow Applications: High electric insulation componentsHigh voltage swit..
Cure Time 0.250 - 1.00 min
0.00417 - 0.0167 hour
3M Scotch-Weld™ CA5 Instant Adhesive
3M™ Scotch-Weld™ Instant Adhesives are single component, high strength cyanoacrylate adhesives. Higher viscosity, slower setting version of CA4 for filling gaps. Meets CID A-A-3097, Type II, Clas..
Cure Time 0.333 - 1.00 min
0.00555 - 0.0167 hour
Time to Handling Strength
3M Scotch-Weld™ EC2500 General Purpose Instant Adhesive
3M™ Scotch-Weld™ General Purpose Instant Adhesives are single component, high strength ethyl cyanoacrylate adhesive designed to bond to a variety of substances including most plastics, rubbers, me..
Cure Time 0.167 - 1.00 min
0.00278 - 0.0167 hour
Time to Handling Strength
3M Scotch-Weld™ LO100 Low Odor Instant Adhesive
3M™ Scotch-Weld™ Low-Odor Instant Adhesives are formulated to have low volatility while maintaining bonding of a wide rage of materials. Low volatility means that these products are not only low o..
Cure Time 0.0833 - 1.00 min
0.00139 - 0.0167 hour
Time to Handling Strength
3M Scotch-Weld™ LO5 Low Odor Instant Adhesive
3M™ Scotch-Weld™ Low-Odor Instant Adhesives are formulated to have low volatility while maintaining bonding of a wide rage of materials. Low volatility means that these products are not only low o..
Cure Time 0.0833 - 1.00 min
0.00139 - 0.0167 hour
Time to Handling
3M Scotch-Weld™ MG05 LO Medical Grade Instant Adhesive
3M™ Scotch-Weld™ Medical Grade Instant Adhesive are intended for use on a wide variety of materials used in the construction of disposable medical assemblies. They will quickly bond metals, plasti..
Cure Time 0.167 - 1.00 min
0.00278 - 0.0167 hour
Time to Handling
3M Scotch-Weld™ MG100 LO Medical Grade Instant Adhesive
3M™ Scotch-Weld™ Medical Grade Instant Adhesive are intended for use on a wide variety of materials used in the construction of disposable medical assemblies. They will quickly bond metals, plasti..
Cure Time 0.500 - 1.00 min
0.00833 - 0.0167 hour
Bulk Molding Compounds BMC 940 Vinyl Ester Bipolar Plate Material
Product Introduction: Bulk Molding Compounds, Inc. is the largest manufacturer of thermoset bulk molding compounds in North America, serving the automotive, appliance, and electrical markets. BMC t..
Cure Time 0.0833 - 1.00 min
0.00139 - 0.0167 hour
Time to Handling Strength
3M Scotch-Weld™ EC600 General Purpose Instant Adhesive
3M™ Scotch-Weld™ General Purpose Instant Adhesives are single component, high strength ethyl cyanoacrylate adhesive designed to bond to a variety of substances including most plastics, rubbers, me..
Cure Time 0.500 - 1.00 min
0.00833 - 0.0167 hour
Time to Handling Strength
3M Scotch-Weld™ PR Gel Plastic and Rubber Instant Adhesive
3M™ Scotch-Weld™ Plastic and Rubber Instant Adhesive is designed to give exceptional performance on difficult-to-bond plastic and rubber substrates. This adhesive may be bonded to like substrates ..
Cure Time 0.500 - 1.00 min
0.00833 - 0.0167 hour
Time to Handling Strength
3M Scotch-Weld™ SI Gel Surface Insensitive Instant Adhesive
3M™ Scotch-Weld™ Surface Insensitive Adhesives bond rough, porous, contaminated, and acidic substrates including wood, cardboard, veneer, fabric, cork, and leather. SI Gel (formerly SB09) is a fas..
Cure Time 0.0833 - 1.00 min
0.00139 - 0.0167 hour
Time to Handling Strength
3M Scotch-Weld™ SI1500 Surface Insensitive Instant Adhesive
3M™ Scotch-Weld™ Surface Insensitive Adhesives bond rough, porous, contaminated, and acidic substrates including wood, cardboard, veneer, fabric, cork, and leather. SI1500 is a surface insensitive..
Cure Time 0.500 - 1.00 min
0.00833 - 0.0167 hour
Bulk Molding Compounds BMC 940 Vinyl Ester Bipolar Plate Material
Bulk Molding Compounds, Inc. is the largest manufacturer of thermoset bulk molding compounds in North America, serving the automotive, appliance, and electrical markets. BMC thermosets are the most ..
Cure Time 0.500 - 1.00 min
0.00833 - 0.0167 hour
Per 1 mm of wall thickness, compression molding
Hexion Bakelite™ EP 8412 Epoxy Resin, High Arc Resistance, Improved Electrical Properties, Low Shrinkage
Epoxy molding compound, inorganically filled, glass fiber reinforced, heat resistant, dimensionally stable, good electrical and mechanical properties, very good chemical resistance, low viscosity, U..
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