Polymer Property : Cure Time = 45.0 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	45.0 min @Temperature 100 °C	0.750 hour @Temperature 212 °F
Parker Chomerics CHO-BOND 360-208 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E..
Cure Time	45.0 min @Temperature 135 °C	0.750 hour @Temperature 275 °F
Resinlab® EP950G Gray Aluminum Filled Rubber Modified Epoxy EP950G Gray is an aluminum filled one part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated temperature. It is a medium paste-like viscosi..
Cure Time	45.0 min @Temperature 100 °C	0.750 hour @Temperature 212 °F
Parker Chomerics CHO-BOND 360-20 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E..
Cure Time	45.0 min @Temperature 149 °C	0.750 hour @Temperature 300 °F
Master Bond EP19HT One Component, Storage Stable Epoxy System Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features excellent storage c..
Cure Time	45.0 min @Temperature 120 °C	0.750 hour @Temperature 248 °F
Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se..
Cure Time	45.0 min @Temperature 100 °C	0.750 hour @Temperature 212 °F
Trelleborg Emerson & Cuming Eccobond® 57C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 57C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveSilver filled, electrically conductive, room temperature curing, epoxy adhesive. Good thermal conduc..
Cure Time	45.0 min @Temperature 100 °C	0.750 hour @Temperature 212 °F
Trelleborg Emerson & Cuming Eccobond® D 778 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming D 778 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, semi-flexible, thixotropic, fast heat curing, epoxy structural adhesive. Good peel strength (20 pli). Recommend..
Cure Time	45.0 min @Temperature 149 °C	0.750 hour @Temperature 300 °F
Master Bond Supreme 10HTN Nickel Filled Electrically Conductive One Part Epoxy Master Bond Polymer System Supreme 10HTN combines high shear and high peel strengths, relatively low resistance, and exceptionally easy processing. This one component (no mix) high purity nickel con..
Cure Time	45.0 min @Temperature 120 °C	0.750 hour @Temperature 248 °F
Tra-Con Tra-Bond 293-1T General Purpose Instrument Epoxy Adhesive-Thixotropic TRA-BOND 293-1T general purpose epoxy adhesive is designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This ver..
Cure Time	45.0 min @Temperature 100 °C	0.750 hour @Temperature 212 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two ..
Cure Time	45.0 min @Temperature 80.0 °C	0.750 hour @Temperature 176 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A..
Cure Time	45.0 min @Temperature 80.0 °C	0.750 hour @Temperature 176 °F	minimum
Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology
Cure Time	45.0 min @Temperature 32.0 °C	0.750 hour @Temperature 89.6 °F	Full Load
Chesterton ARC MX5 Rapid Curing Fine Particle Wear Compound Description: An advanced ceramic reinforced composite for the emergency repair and protection of all metal surfaces subjected to severe erosion, corrosion, and chemical attack. It is applied at a th..
Cure Time	45.0 min @Temperature 25.0 °C	0.750 hour @Temperature 77.0 °F	Full Load
Chesterton MRS 5 Metal Rebuilding System MRS 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patch holes as we..
Cure Time	45.0 min @Temperature 175 °C	0.750 hour @Temperature 347 °F
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also ..
Cure Time	45.0 - 60.0 min @Temperature 100 °C	0.750 - 1.00 hour @Temperature 212 °F
ACC QGel 315 QSI Quantum Silicones General Purpose Silicone Gel QGel 315 is a clear, very soft, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid..
Cure Time	45.0 min @Temperature 50.0 °C	0.750 hour @Temperature 122 °F
Atom Adhesives AA-DUCT 902 Epoxy Adhesive and Coating AA-DUCT 902 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of..
Cure Time	45.0 min @Temperature 50.0 °C	0.750 hour @Temperature 122 °F
Atom Adhesives AA-DUCT 903 Epoxy Adhesive AA-DUCT 903 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an electrical resistivity value of less tha..
Cure Time	45.0 min @Temperature 75.0 °C	0.750 hour @Temperature 167 °F	Dry to handle, at 50% humidity and 75°C
Blue River Coatings High Performance Acrylic Sanding Sealer BLUE RIVER COATINGS HIGH PERFORMANCE ACRYLIC SANDING SEALER is a waterbased wood sealer to fill the grain. The product is designed to be a sandable self-sealing topcoat for wood. HIGH PERFORMANCE AC..
Cure Time	45.0 min @Temperature 75.0 °C	0.750 hour @Temperature 167 °F	Dry to handle, at 50% humidity and 75°C
Blue River Coatings High Performance Acrylic Topcoat BLUE RIVER COATINGS HIGH PERFORMANCE ACRYLIC TOPCOAT is a water dispersible acrylic enamel. HIGH PERFORMANCE ACRYLIC TOPCOAT is designed to be a low VOC and EPA compliant coating with excellent cove..
Cure Time	45.0 min @Temperature 75.0 °C	0.750 hour @Temperature 167 °F	Dry to handle, at 50% humidity and 75°C
Blue River Coatings Hyfro-Flex Polyurethane Top Coat BLUE RIVER COATINGS HYDRO-FLEX POLYURETHANE TOPCOAT is a water dispersible polyurethane. When the customer receives HYDRO-FLEX, it is already formed in the container, where as the solvent base type,..
Cure Time	45.0 min @Temperature 149 °C	0.750 hour @Temperature 300 °F	alternate cure
Aremco Aremco-Bond™ 2330 High Performance Epoxide Single-Part, Heat Curable, Silicone Elastomer Adhesive
Cure Time	45.0 min @Temperature 23.0 °C	0.750 hour @Temperature 73.4 °F	M10 steel, handling strength
Permabond A131 Anaerobic Threadsealant Permabond® A131 is an anaerobic adhesive designed to seal threaded metal pipe connections carrying a wide variety of gases and liquids, including potable water. Suitable for use on both parallel an..
Cure Time	45.0 - 60.0 min @Temperature 149 °C	0.750 - 1.00 hour @Temperature 300 °F
Master Bond Supreme 10HTFL One Part Epoxy Cures at 250°F Description: Master Bond Polymer System Supreme 10HTFL features a blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4..