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- Polymer Property : Cure Time = 168 hour
Polymer Property : Cure Time = 168 hour Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 5760 - 10100 min @Temperature 25.0 °C |
96.0 - 168 hour @Temperature 77.0 °F |
full cure |
| Permabond ET5401 Epoxy Resin PERMABOND® ET5401 is a two-part, 2:1 mixable, semi-flexible toughened no slump epoxy adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plastics and compo.. |
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| Cure Time | 4320 - 10100 min @Temperature 25.0 °C |
72.0 - 168 hour @Temperature 77.0 °F |
Complete Cure Cycle |
| Northstar Polymers MPG-D70A Room-Temperature-Curable Polyurethane Casting Elastomer MPG-D70A is room-temperature-curable polyurethane casting elastomer system designed for molding polyurethane parts with tough, but flexible physical characteristics. The typical applications for th.. |
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| Cure Time | 2880 - 10100 min @Temperature 23.0 °C |
48.0 - 168 hour @Temperature 73.4 °F |
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| Resin Technology Group UV MX-2240 Multi-Functional Hybrid, UV-Curing, Micro-Electronic System Mix ratio 2 to 1 by volume.UV-MX 2240 is a low-viscosity, water-white photo/ chemical cross-linking encapsulant/sealant designed for micro-electronic applications. This two-part, Hybrid UV-epoxy bas.. |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 9321 Paste Adhesive System Thixotropic adhesive that yields tough, durable bonds over a wide temperature range.Applications: Potting Structural Repair |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 9330.3 Paste Adhesive System Non-slump, thixotropic adhesive with high peel strength and excellent environmental durability.Applications:Structural Repair Composite Bonding |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 9309.3NA Paste Adhesive System Toughened adhesive with excellent peel strength. Contains glass beads for bond line control.Applications: Structural Repair Composite Bonding |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 934NA Paste Adhesive System Two part adhesive system with superior strengthCures at room temperatureApplications: Potting Structural Repair Liquid Shim |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 9359.3 Paste Adhesive System Excellent peel and shear strength. Bonds a variety of substrates.Applications: Structural Repair Composite Bonding |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 9360 Paste Adhesive System Structural adhesive, exhibits excellent peel strength, tensile lap shear strength.Applications: Structural Repair Composite Bonding Liquid Shim |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 9377 Paste Adhesive System Moldable plastic shim, excellent microcracking resistance under thermal cycling. High compressive strength.Application: Liquid Shim |
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| Cure Time | 7200 - 10100 min @Temperature 23.0 °C |
120 - 168 hour @Temperature 73.4 °F |
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| Master Bond EP29LP Low Exotherm, Low Viscosity Two Component Epoxy System Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bon.. |
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| Cure Time | 7200 - 10100 min @Temperature 23.0 °C |
120 - 168 hour @Temperature 73.4 °F |
|
| Master Bond EP37-3 Optically Clear, Impact Resistant Two Component Epoxy Master Bond Polymer System EP37-3 is a low viscosity, resilient, optically clear two component epoxy resin system designed for high performance bonding, coating and casting applications. As an adhes.. |
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| Cure Time | 7200 - 10100 min @Temperature 23.0 °C |
120 - 168 hour @Temperature 73.4 °F |
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| Master Bond EP29LPSP Low Outgassing, Optically Clear Two Component Epoxy Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. EP29LPSP is serviceable at.. |
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| Cure Time | 2880 - 10100 min @Temperature 25.0 °C |
48.0 - 168 hour @Temperature 77.0 °F |
|
| Tra-Con Tra-Bond 813J01 Silicone Encapsulant TRA-BOND 813J01 is a silicone adhesive system formulated to provide excellent thermal conductivity. This unique product bonds well to difficult substrates. Typical applications include encapsulation.. |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 9313 Paste Adhesive System Very low viscosity adhesive yielding tough, flexible bonds. Injectable. |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 9320NA Paste Adhesive System High shear and high peel adhesive system with room temperature cure. |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 9323 Paste Adhesive System Viscous, but pourable, liquid adhesive that yields tough, durable adhesive bonds over a wide temperature range.Application: Structural Repair |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
|
| Henkel Hysol EA 9330 Paste Adhesive System Easy mix adhesive with high peel strength and excellent environmental durability.Applications: Structural Repair Composite Bonding |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 9396.6MD Paste Adhesive System Cure syntactic, with excellent high temperature properties. Applications: Potting Syntactic |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 9394 Paste Adhesive System Thixotropic adhesive with structural properties to 350°F / 177°C.Applications: Potting Structural Repair Composite Bonding Liquid Shim |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 9395 Paste Adhesive System Two-part, nonmetallic-filled version of Hysol EA 9394.Applications: Potting Structural Repair Composite Bonding |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 9396 Paste Adhesive System Two-part, low viscosity, unfilled version of Hysol EA 9394. Qualified to BMS 8-301.Applications: Structural Repair Low Viscosity Wet Lay-Up Composite Bonding |
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| Cure Time | 7200 - 10100 min @Temperature 25.0 °C |
120 - 168 hour @Temperature 77.0 °F |
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| Henkel Hysol EA 956 Paste Adhesive System Very low viscosity, cures at room temperatureDesigned for wet lay-up repairApplications: Structural Repair Low Viscosity Wet Lay-Up |
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