Polymer Property : Cure Time = 0.750 hour Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Cure Time	45.0 min @Temperature 100 °C	0.750 hour @Temperature 212 °F
Parker Chomerics CHO-BOND 360-208 Conductive Epoxy Low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epoxy, and the superior electrical conductivity of silver. It is recommended as a thermo-setting E..
Cure Time	45.0 min @Temperature 135 °C	0.750 hour @Temperature 275 °F
Resinlab® EP950G Gray Aluminum Filled Rubber Modified Epoxy EP950G Gray is an aluminum filled one part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated temperature. It is a medium paste-like viscosi..
Cure Time	45.0 min @Temperature 125 Â°C	0.750 hour @Temperature 257 Â°F
Momentive Performance Materials TSE326 High Temperature, Heat Cured One Component Silicone Adhesive TSE326 is a one-component, heat curing silicone adhesive which offers extended performance at temperatures exceeding 200C. A flowable material with primerless adhesion to many substrates, it is suit..
Cure Time	45.0 min @Temperature 149 °C	0.750 hour @Temperature 300 °F
Master Bond Supreme 10HTS Silver Filled Electrically Conductive One Part Epoxy Master Bond Supreme 10HT/S is a one component, no mix high purity silver conductive system formulated to cure at elevated temperatures. Tensile shear strengths greater than 1,200 psi and T-peel stre..
Cure Time	45.0 min @Temperature 120 °C	0.750 hour @Temperature 248 °F
Tra-Con Tra-Bond 293-1 General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1 general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. The 293-se..
Cure Time	45.0 min @Temperature 120 °C	0.750 hour @Temperature 248 °F
Tra-Con Tra-Bond 293-1.5T General Purpose Instrument Epoxy Adhesive-Flexible TRA-BOND 293-1.5T general purpose epoxy adhesive is designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This v..
Cure Time	45.0 min @Temperature 120 °C	0.750 hour @Temperature 248 °F
Tra-Con Tra-Bond 293-1M General Purpose Instrument Epoxy Adhesive TRA-BOND 293-1M general purpose epoxy adhesive is designed to provide strong, resilient bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper and brass. The 293-se..
Cure Time	45.0 min @Temperature 100 °C	0.750 hour @Temperature 212 °F
Trelleborg Emerson & Cuming Eccobond® 57C Two-Component Silver Filled Electrically Conductive Epoxy Adhesive Emerson & Cuming 57C Eccobond® Two-Component Silver Filled Electrically Conductive Epoxy AdhesiveSilver filled, electrically conductive, room temperature curing, epoxy adhesive. Good thermal conduc..
Cure Time	45.0 min @Temperature 100 °C	0.750 hour @Temperature 212 °F
Trelleborg Emerson & Cuming Eccobond® D 778 One-Component Fast Cure Epoxy Adhesive Emerson & Cuming D 778 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, semi-flexible, thixotropic, fast heat curing, epoxy structural adhesive. Good peel strength (20 pli). Recommend..
Cure Time	45.0 min @Temperature 149 °C	0.750 hour @Temperature 300 °F
Master Bond Supreme 10HTN Nickel Filled Electrically Conductive One Part Epoxy Master Bond Polymer System Supreme 10HTN combines high shear and high peel strengths, relatively low resistance, and exceptionally easy processing. This one component (no mix) high purity nickel con..
Cure Time	45.0 min @Temperature 120 °C	0.750 hour @Temperature 248 °F
Tra-Con Tra-Bond 293-1T General Purpose Instrument Epoxy Adhesive-Thixotropic TRA-BOND 293-1T general purpose epoxy adhesive is designed to provide strong, semi-rigid bonds to a variety of difficult-to-bond substrates, such as gold, nickel, silver, copper, and brass. This ver..
Cure Time	45.0 min @Temperature 140 °C	0.750 hour @Temperature 284 °F
Trelleborg Emerson & Cuming Eccobond® G757 One-Component High Strength-Impact Resistant Epoxy Adhesive Emerson & Cuming G757 Eccobond® One-Component High Strength-Impact Resistant Epoxy AdhesiveVery flexible, thixotropic, epoxy adhesive. Excellent low temperature resistance. Excellent adhesion to gl..
Cure Time	45.0 min @Temperature 25.0 °C	0.750 hour @Temperature 77.0 °F	Full Load
Chesterton ARC 5 Paste grade Rapid Cure Abrasion Control Description: ARC 5 is an advanced composite formulated for emergency repair and patching of metal components subject to light abrasive and corrosive conditions. It can be used to seal leaks and patc..
Cure Time	45.0 min @Temperature 100 °C	0.750 hour @Temperature 212 °F	Minimum Bond Line
Epoxy Technology EPO-TEK® H20S Electrically Conductive, Silver Epoxy for Die Stamping Product Description: EPO-TEK® H20S is a modified version of EPO-TEK® H20E, designed primarily for die stamping and dispensing techniques for chip bonding. EPO-TEK®H20S is a highly reliable, two ..
Cure Time	45.0 min @Temperature 80.0 °C	0.750 hour @Temperature 176 °F	minimum
Epoxy Technology EPO-TEK® H55 Epoxy Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology
Cure Time	45.0 min @Temperature 175 °C	0.750 hour @Temperature 347 °F
Epoxy Technology EPO-TEK® H20E Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also ..
Cure Time	45.0 - 60.0 min @Temperature 100 °C	0.750 - 1.00 hour @Temperature 212 °F
ACC QGel 315 QSI Quantum Silicones General Purpose Silicone Gel QGel 315 is a clear, very soft, tough moderately cross-linked silicone polymer. Silicone gels are used to provide protection from vibration and thermal or mechanical shock. Silicone gels also provid..
Cure Time	45.0 min @Temperature 50.0 °C	0.750 hour @Temperature 122 °F
Atom Adhesives AA-DUCT 903 Epoxy Adhesive AA-DUCT 903 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an electrical resistivity value of less tha..
Cure Time	45.0 min @Temperature 75.0 °C	0.750 hour @Temperature 167 °F	Dry to handle, at 50% humidity and 75°C
Blue River Coatings Hyfro-Flex Polyurethane Top Coat BLUE RIVER COATINGS HYDRO-FLEX POLYURETHANE TOPCOAT is a water dispersible polyurethane. When the customer receives HYDRO-FLEX, it is already formed in the container, where as the solvent base type,..
Cure Time	45.0 min @Temperature 100 °C	0.750 hour @Temperature 212 °F
ACC QSil 550SB QSI Quantum Silicones Self-Priming Silicone Potting Material QSil 550SB is a 100% silicone solids elastomer designed for electronic potting applications. The two-component system offers a hard, thermally conductive, low modulus material that is readily repair..
Cure Time	45.0 min @Temperature 149 °C	0.750 hour @Temperature 300 °F	alternate cure
Aremco Aremco-Bond™ 2330 High Performance Epoxide Single-Part, Heat Curable, Silicone Elastomer Adhesive
Cure Time	45.0 - 60.0 min @Temperature 149 °C	0.750 - 1.00 hour @Temperature 300 °F
Master Bond Supreme 10HTFL One Part Epoxy Cures at 250°F Description: Master Bond Polymer System Supreme 10HTFL features a blend of physical properties including outstanding peel strength, very high shear strength and a wide service temperature range of 4..