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Polymer Property : Cure Time = 0.333 hour Product List

Processing Properties

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Processing Properties Metric English Comments
Cure Time 20.0 min

@Temperature 177 °C
0.333 hour

@Temperature 351 °F
Resinlab® EP950G Gray Aluminum Filled Rubber Modified Epoxy
EP950G Gray is an aluminum filled one part rubber modified epoxy designed for bonding metal and other structural material subject to stress at elevated temperature. It is a medium paste-like viscosi..
Cure Time 20.0 min

@Temperature 135 °C
0.333 hour

@Temperature 275 °F
Hot Plate
Lord Adhesives Thermosetâ„¢ MD-130 Electrically Insulating Die-Attach Adhesive
Lord MD-130 is a microelectronic grade, die-attach adhesive system for use in applications where electrical conductivity is not required. This system offers long, room temperature stability, fast cu..
Cure Time 20.0 min

@Temperature 125 °C
0.333 hour

@Temperature 257 °F
Momentive Performance Materials LVG342B Low Volatile Silicone Adhesive Component, Clear
LVG342 low volatile silicone adhesive is a two component, thixotropic silicone adhesive that cures very quickly at elevated temperatures to a durable elastomer. LV342 was specifically developed for..
Cure Time 20.0 min

@Temperature 125 °C
0.333 hour

@Temperature 257 °F
Momentive Performance Materials LVG342A Low Volatile Silicone Adhesive Component, White
LVG342 low volatile silicone adhesive is a two component, thixotropic silicone adhesive that cures very quickly at elevated temperatures to a durable elastomer. LV342 was specifically developed for..
Cure Time 20.0 min

@Temperature 120 °C
0.333 hour

@Temperature 248 °F
Trelleborg Emerson & Cuming Eccobond® D 778 One-Component Fast Cure Epoxy Adhesive
Emerson & Cuming D 778 Eccobond® One-Component Fast Cure Epoxy AdhesiveHigh strength, semi-flexible, thixotropic, fast heat curing, epoxy structural adhesive. Good peel strength (20 pli). Recommend..
Cure Time 20.0 min

@Temperature 120 °C
0.333 hour

@Temperature 248 °F
Trelleborg Emerson & Cuming Eccobond® 3193-17 Lighting Epoxy Adhesive
Emerson & Cuming 3193-17 Eccobond® Lighting Epoxy AdhesiveOne component, heat curing thixotropic epoxy adhesive. 100% solids and elastomer modified. Bonds well to ABS, polycarbonate and other heat ..
Cure Time 20.0 min

@Temperature 160 °C
0.333 hour

@Temperature 320 °F
Trelleborg Emerson & Cuming Eccobond® 930-09 Low Temperature Performance Lighting Epoxy Adhesive
Emerson & Cuming 930-09 Eccobond® Low Temperature Performance Lighting Epoxy AdhesiveFlexible, non-blushing, epoxy adhesive for glass headlamp bonding. Maintains flexibility at temperatures as low ..
Cure Time 20.0 min

@Temperature 120 °C
0.333 hour

@Temperature 248 °F
Trelleborg Emerson & Cuming Eccobond® D 275 One-Component Fast Cure Epoxy Adhesive
Emerson & Cuming D 275 Eccobond® One-Component Fast Cure Epoxy AdhesiveSemi-rigid, high strength, fast curing, pourable, epoxy structural adhesive. Good peel strength (12 pli), Recommended for bond..
Cure Time 20.0 min

@Temperature 175 °C
0.333 hour

@Temperature 347 °F
Hexcel® Redux® 840 One-part Foaming Epoxy Paste Adhesive
Redux® 840 is a black one-part, foaming, epoxy paste adhesive that is thixotropic.Features: Provides a shear-carrying connection across any discontinuities in bonded sandwich panels; Maximum servic..
Cure Time 20.0 min

@Temperature 100 °C
0.333 hour

@Temperature 212 °F
Dow Corning Q3-6575 DIELECTRIC GEL A/B KIT
Two-part, clear, RT or heat cure and low temperature (-80°C/-112°F)stability.Information provided by Dow Corning
Cure Time 20.0 min

@Temperature 25.0 °C
0.333 hour

@Temperature 77.0 °F
tack free
Cytec CC-1191 (Conap) Acrylic Dielectric Conformal Coating
Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time 20.0 min

@Temperature 25.0 °C
0.333 hour

@Temperature 77.0 °F
tack free
Cytec CE-1171 (Conap) Acrylic Dielectric Conformal Coating
Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time 20.0 - 30.0 min

@Temperature 25.0 °C
0.333 - 0.500 hour

@Temperature 77.0 °F
tack free
Cytec Conathane® CC-1194 (Conap) Polyurethane Dielectric Conformal Coating
Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i..
Cure Time 20.0 min

@Temperature 120 °C
0.333 hour

@Temperature 248 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® 375 High Temperature Epoxy
Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy..
Cure Time 20.0 min

@Temperature 120 °C
0.333 hour

@Temperature 248 °F
Epoxy Technology EPO-TEK® EV2118-2 Silver-filled, electrically conductive epoxy
Preliminary Product Information SheetMaterial Description: A silver-filled, electrically conductive epoxy designed for semiconductor and electronic assembly.Information Provided by Epoxy Technology
Cure Time 20.0 min

@Temperature 100 °C
0.333 hour

@Temperature 212 °F
Minimum Bond Line
Epoxy Technology EPO-TEK® H24 Electrically Conductive Epoxy
Product Description: EPO-TEK® H24 is a two component, electrically and thermally conductive epoxy adhesive designed for semiconductor die attach and hybrid micro-electronics assembly.Advantages & A..
Cure Time 20.0 min

@Temperature 100 °C
0.333 hour

@Temperature 212 °F
minimum
Epoxy Technology EPO-TEK® H55 Epoxy
Material Description: A two component, thixotropic and high temperature epoxy designed to be used for hybrids and PCB applications.Information Provided by Epoxy Technology
Cure Time 20.0 min

@Temperature 80.0 °C
0.333 hour

@Temperature 176 °F
minimum
Epoxy Technology EPO-TEK® OE120 Two Component Epoxy
Material Description: A two component, opaque epoxy, designed for fiber optics packaging applications. It is a black-colored version of EPO-TEK 353ND-T. It has a high Tg for resisting elevated ope..
Cure Time 20.0 min

@Temperature 149 °C
0.333 hour

@Temperature 300 °F
3M Scotchcast™ 260 8 G Electrical Epoxy Powder Resin
3M Scotchcast Electrical Resin 260 is a widely used, well-known general purpose epoxy powder resin. A one-part, green pigmented, rapid heat-curing product, it is designed to provide a continuous, to..
Cure Time 20.0 min

@Temperature 177 °C
0.333 hour

@Temperature 351 °F
3M Scotchcast™ 262 Electrical Epoxy Powder Resin
3M Scotchcast Electrical Resin 262 is a widely used, well-known general purpose epoxy powder resin. A one-part, red pigmented, rapid heat-curing product, it is designed to provide a continuous, toug..
Cure Time 20.0 - 60.0 min

@Temperature 24.0 °C
0.333 - 1.00 hour

@Temperature 75.2 °F
demold time
BCC Products Proto-Kast BC 8163 Urethane Casting
BC 8163 is a very low viscosity, rapid setting, rigid urethane compound. This system will cure quickly to a hard, tough, impact resistant casting. BC 8163 is non-sensitive to moisture after cure and..
Cure Time 20.0 min

@Temperature 180 °C
0.333 hour

@Temperature 356 °F
Abatron AboCast 8708-10 One-Component Structural/Dielectric Epoxy
AboCast 8708-10 is a highly filled, class H (180°C) structural, castable adhesive compound for FAST high-temperature curing. Suggested Uses: Structural bonding; Casting; Potting; Encapsulating; Em..
Cure Time 20.0 min

@Temperature 177 °C
0.333 hour

@Temperature 351 °F
3M Scotchkote™ 412 Spray Grade Fusion Bonded Epoxy Coating
3M Scotchkote Spray Grade Fusion Bonded Epoxy Coating 413 is a one-part, heat curable, thermosetting epoxy coating designed for corrosion protection of reinforcing steel. The epoxy is applied to pre..
Cure Time 20.0 min

@Temperature 24.0 °C
0.333 hour

@Temperature 75.2 °F
Followed by 20 min 60°-75°C
Parker Chomerics CHO-SHIELD® 2052 Conductive Coating
CHO-SHIELD® 2052 silver-plated-copper filled commercial-grade coating proved high levels of EMI shielding effectiveness, abrasion resistance and excellent adhesion on a variety of materials used fo..
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