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- Polymer Property : Pot Life = 90.0 min
Polymer Property : Pot Life = 90.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Pot Life | 90.0 min @Temperature 25.0 °C |
90.0 min @Temperature 77.0 °F |
20 gm mass |
| Resin Technology Group TIGA 901 Room Temperature Curing Silver Conductive Epoxy 100 parts resin to 6 parts hardener. Cure 24 hours at 25°C, 1-4 hours at 65°C, 30-60 minutes at 125°C, or 30 minutes at 150°C.TIGA 901 is an electrically conductive, silver filled epoxy adhesiv.. |
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| Pot Life | 90.0 min @Temperature 25.0 °C |
90.0 min @Temperature 77.0 °F |
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| Momentive Performance Materials RTV11 White General Purpose Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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| Pot Life | 90.0 min @Temperature 25.0 °C |
90.0 min @Temperature 77.0 °F |
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| Momentive Performance Materials RTV511 White Extreme Low Temperature Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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| Pot Life | 90.0 min @Temperature 25.0 °C |
90.0 min @Temperature 77.0 °F |
|
| Momentive Performance Materials RTV566 Red Extreme High Temperature Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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| Pot Life | 90.0 min @Temperature 25.0 °C |
90.0 min @Temperature 77.0 °F |
100 grams |
| Cytec (Conap) FR-1272 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Pot Life | 90.0 - 120 min @Temperature 25.0 °C |
90.0 - 120 min @Temperature 77.0 °F |
100 grams |
| Cytec (Conap) FR-1273 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Pot Life | 90.0 min @Temperature 25.0 °C |
90.0 min @Temperature 77.0 °F |
100 grams |
| Cytec (Conap) RN-1000 / EA-87 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Pot Life | 90.0 min @Temperature 120 °C |
90.0 min @Temperature 248 °F |
|
| Abatron AboCast/AboCure 8109-1 High melting point.Processing: 100/30 pbw; mix at 130-140°C (270 °F); cures in 16 h/120°C (250°F), 10 h/140°C (285°F), 8 h/160°C (320°F), 2 h/ 200°C (390°F).Applications: Heavy duty castin.. |
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| Pot Life | 90.0 min @Temperature 120 °C |
90.0 min @Temperature 248 °F |
|
| Abatron AboCast/AboCure 8109-2 High melting point. Filled version.Processing: 100/10 pbw; 90 minute potlife; mix at 130-140°C (270 °F); cures in 16 h/120°C (250°F), 10 h/140°C (285°F), 8 h/160°C (320°F), 2 h/ 200°C (390°.. |
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| Pot Life | <= 90.0 min @Temperature 25.0 °C |
<= 90.0 min @Temperature 77.0 °F |
100 g |
| Armstrong A-12 Epoxy Adhesive, at 1:1 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati.. |
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| Pot Life | <= 90.0 min @Temperature 25.0 °C |
<= 90.0 min @Temperature 77.0 °F |
100 g |
| Armstrong A-12 Epoxy Adhesive, at 2:3 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati.. |
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| Pot Life | <= 90.0 min @Temperature 25.0 °C |
<= 90.0 min @Temperature 77.0 °F |
100 g |
| Armstrong A-12 Epoxy Adhesive, at 3:2 Mix Ratio Our most popular general-purpose, high viscosity adhesive for industry. Combines low toxicity with excellent physical properties, and offers a non-critical mixing ratio of 1:1 by weight. This rati.. |
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| Pot Life | <= 90.0 min @Temperature 25.0 °C |
<= 90.0 min @Temperature 77.0 °F |
100 g |
| Armstrong A-12-T Epoxy Adhesive Provides the same basic properties as A-12, but in thixotropic, non-sag, easily-brushable paste form. An ideal material for use where adhesive flow during cure cannot be tolerated. A-12-T meets t.. |
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| Pot Life | <= 90.0 min @Temperature 25.0 °C |
<= 90.0 min @Temperature 77.0 °F |
100 g |
| Armstrong A-2/E Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac.. |
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| Pot Life | <= 90.0 min @Temperature 25.0 °C |
<= 90.0 min @Temperature 77.0 °F |
100 g |
| Armstrong A-2/H20 Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac.. |
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| Pot Life | <= 90.0 min @Temperature 25.0 °C |
<= 90.0 min @Temperature 77.0 °F |
100 g |
| Armstrong A-271 Epoxy Adhesive A clear amber adhesive system. A-271 is a medium viscosity liquid with excellent wetting ability. It is ideal for bonding glass or similar smooth surfaces. It features very low shrinkage coupled .. |
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| Pot Life | <= 90.0 min @Temperature 25.0 °C |
<= 90.0 min @Temperature 77.0 °F |
100 g |
| Armstrong C-4/W Epoxy Adhesive A low viscosity, clear amber, unfilled adhesive, recommended for use with activators D or W. C-4 with Activator W offers maximum versatility in that differing degrees of flexibility can be achieved .. |
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| Pot Life | <= 90.0 min @Temperature 25.0 °C |
<= 90.0 min @Temperature 77.0 °F |
100 g |
| Armstrong C-7/W Epoxy Adhesive, 1:1 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may .. |
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| Pot Life | <= 90.0 min @Temperature 25.0 °C |
<= 90.0 min @Temperature 77.0 °F |
100 g |
| Armstrong C-7/W Epoxy Adhesive, 2:3 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may .. |
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| Pot Life | <= 90.0 min @Temperature 25.0 °C |
<= 90.0 min @Temperature 77.0 °F |
100 g |
| Armstrong C-7/W Epoxy Adhesive, 3:2 Mix Ratio A clear, unfilled, medium viscosity adhesive recommended for use with any Armstrong Activator. Physical property data included covers C-7 used with Activators W and H-20. All other Activators may .. |
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| Pot Life | 90.0 min @Temperature 25.0 °C |
90.0 min @Temperature 77.0 °F |
100 g mass |
| Aremco Aremco-Bond™ 2335 Ultra High Temperature Epoxy Ceramic-Filled, Low Expansion, High Lap-Shear Strength & Chemical Resistance, Low Outgassing. |
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| Pot Life | 90.0 min @Temperature 23.0 °C |
90.0 min @Temperature 73.4 °F |
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| Loctite® 3888 Room Temperature Cure Isotropic Epoxy Adhesive Electrically Conductive BondersLoctite® Electrically Conductive Adhesives are used in a variety of applications where electrical connectivity is needed, providing a conductive path where traditiona.. |
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| Pot Life | 90.0 min @Temperature 25.0 °C |
90.0 min @Temperature 77.0 °F |
4 fl. Oz.; ASTM D2471 |
| Fibre Glast ProSet 125R / 229H Epoxy
(discontinued **) Information provided by Fibre Glast Developments Corporation. |
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