Polymer Property : Pot Life = 90 min Product List

Processing Properties

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Processing Properties	Metric	English	Comments
Pot Life	60 - 90 min	60 - 90 min	Mass: 50g; TM R050-19
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Pot Life	60 - 90 min	60 - 90 min	Mass: 100g; TM R050-17
Resinlab® EP1285HD-16 Highly Filled, Medium Viscosity Casting Resin Resinlab™ EP1285 (Formerly Lab Product W021901 series) is a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity and a low C..
Pot Life	60 - 90 min	60 - 90 min	Mass: 150g; TM R050-19
Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (..
Pot Life	60 - 90 min @Temperature 25.0 Â°C	60 - 90 min @Temperature 77.0 Â°F
Lord Adhesives Thermosetâ„¢ UR-329 Two Component Urethane Potting Compound Lord UR-329 is a flexible, two-component, room temperature curing, urethane, encapsulating compound. UR-329 maintains low hardness and modulus over a wide temperature range, which imparts minimal st..
Pot Life	60 - 90 min	60 - 90 min	100 gram batch
Master Bond EP21HTND High Temperature Resistant, Non-Drip Epoxy Compound Description: Master Bond EP21HTND is a two component, room temperature curing epoxy adhesive, sealant and coating with a paste viscosity and non-drip application feature. Its features are easy handl..
Pot Life	60 - 90 min	60 - 90 min	100 gram mass
Master Bond EP21LV-LO Two Component, Lower Viscosity, Room Temperature Curing Epoxy System Product Description: Master Bond EP21LV-LO is a two component, lower viscosity, room temperature curing epoxy system for high performance bonding, sealing, coating and encapsulation. This user frien..
Pot Life	75 - 90 min	75 - 90 min	100 gram mass
Master Bond EP21TDCN Two Component Nickel Conductive Epoxy Adhesive Product Description: Master Bond Polymer System EP21TDCN is a two component, nickel filled, electrically conductive, adhesive for high performance bonding, formulated to cure at room temperature or ..
Pot Life	75 - 90 min	75 - 90 min	100 gram mass
Master Bond EP21TDCNFL Two Component Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP21TDCNFL is a two component, nickel filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Pot Life	75 - 90 min	75 - 90 min	50 gram mass
Master Bond EP21TDCSFL Flexible Two Component Silver Conductive Epoxy Master Bond Polymer System EP21TDCSFL is a two component, silver filled, electrically conductive system for high performance bonding and sealing formulated to cure at room temperature or more rapidl..
Pot Life	60 - 90 min	60 - 90 min	100 gram batch
Master Bond EP33CLV Epoxy Resists Chemicals and High Temperatures Description: Master Bond EP33CLV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and excel..
Pot Life	60 - 90 min	60 - 90 min	100 gram batch
Master Bond EP37-3FLFAN Electrically Isolating, Flexible Epoxy Description: Master Bond Polymer System EP37-3FLFAN is a two component system for high performance potting, bonding, sealing and coating that is formulated to cure at room temperature or more rapidl..
Pot Life	75 - 90 min	75 - 90 min	100 gram batch
Master Bond EP76M-1R Nickel Conductive Epoxy Adhesive Description: Master Bond Polymer System EP76M-1R is a two component, nickel filled, electrically conductive adhesive for high performance bonding formulated to cure at room temperature or more rapid..
Pot Life	75 - 90 min	75 - 90 min	50 gm mass
Master Bond EP79FL Two Component Silver Nickel Conductive Epoxy Adhesive Master Bond Polymer System EP79FL is a two component, silver-coated nickel, electrically conductive system for high performance bonding and sealing. Its most salient features are its high flexibilit..
Pot Life	60 - 90 min	60 - 90 min	100 gram batch
Master Bond EP42-2LV Epoxy Resists Heat and Chemicals Description: Master Bond Polymer System EP42-2LV is a low viscosity room temperature curable two component epoxy, adhesive, sealant, coating and casting material featuring outstanding chemical resis..
Pot Life	60 - 90 min	60 - 90 min	100 gram mass
Master Bond Supreme 33 High Temperature Resistant, Structural Adhesive Description: Master Bond Polymer System Supreme 33 is a unique, room temperature curing, toughened epoxy adhesive/sealant, offering high temperature resistance. This innovative system offers high bo..
Pot Life	60 - 90 min	60 - 90 min
Master Bond Supreme 33CLV Two Component, Room Temperature Curing Toughened Epoxy Master Bond Polymer System Supreme 33CLV is a special, room temperature curing, toughened epoxy adhesive/sealant, featuring exceptionally high temperature resistance. This innovative system has outs..
Pot Life	60 - 90 min	60 - 90 min	Working life
Abatron MasterMold 12-8 Flexible Mold Making Compound Master mold 12-8 is a pourable version of MasterMold 12-3 for creating a mold by pouring it into, or around, the model.Processing: Part A Resin: Clear, pourable viscous liquid, 8.7 lbs/galPart B Con..
Pot Life	60 - 90 min	60 - 90 min	Working life
Abatron MasterMold 12-3 Flexible Mold Making Compound Master mold 12-3 is formulated for versatility, high elasticity and strength. It is a 2-component polyurethane system and can be easily spread on any model to produce a smooth bubble-free mold surf..
Pot Life	60 - 90 min	60 - 90 min	Mass: 100g; TM R050-19
Resinlab® EP1296 Highly Filled, Moderately Thixotropic Black Casting Resin Resinlab™ EP1296 is a highly filled, moderately thixotropic black casting resin designed for applications requiring good thermal conductivity, low shrinkage and a low CTE. It was especially formula..
Pot Life	60 - 90 min	60 - 90 min	Mass: 50g; TM R050-19
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I..
Pot Life	60 - 90 min	60 - 90 min	Mass: 50g; TM R050-19
Resinlab® EP1306 Acrylic / Epoxy Hybrid Adhesive EP1306 is a two part acrylic / epoxy hybrid adhesive utilizing a 50% weight loading of aluminum powder into both components. It cures quickly at room temperature to a tough, rigid polymer. It has go..
Pot Life	60 - 90 min	60 - 90 min	100 gram batch
Master Bond EP33LV Epoxy Has Dimensional Stability and Machinability Description: Master Bond EP33LV is a two part, room temperature curing epoxy system used for bonding, sealing and coating featuring high temperature resistance, good dimensional stability and very g..