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- Polymer Property : Pot Life = 60.0 min
Polymer Property : Pot Life = 60.0 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Pot Life | 60.0 min @Temperature 23.0 °C |
60.0 min @Temperature 73.4 °F |
2X Starting Viscosity |
| Parker Chomerics THERM-A-FORM 1642 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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| Pot Life | 60.0 min @Temperature 23.0 °C |
60.0 min @Temperature 73.4 °F |
2X Starting Viscosity |
| Parker Chomerics THERM-A-FORM T642 Cure-in-Place Potting and Underfill Material Description: THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics co.. |
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| Pot Life | 60.0 - 90.0 min | 60.0 - 90.0 min | |
| Northstar Polymers MYP-V40A Polyurethane Filler Gel This polyurethane casting material is developed for applications that require inexpensive liquid resin filler such as encapsulation of a large electric components or puncture-free tire for low-speed.. |
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| Pot Life | 60.0 - 120 min @Temperature 20.0 °C |
60.0 - 120 min @Temperature 68.0 °F |
|
| Permabond ET505 Epoxy Resin PERMABOND ET505 is a two-part, 1:1 mixable epoxy adhesive. ET505 is a semi-flexible toughened epoxy adhesive with good adhesion to a variety of substrates such as wood, metal, ceramics and some plas.. |
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| Pot Life | 60.0 min @Temperature 23.9 °C |
60.0 min @Temperature 75.0 °F |
|
| 3M Scotch-Weld™ 3549 B/A Brown Two-Part Urethane Adhesive 3549 B/A Brown
(discontinued **) Two-part urethane adhesives cure at room temperature or with heat to provide tough, impact resistant bonds with high peel strength. Features include long worklife adhesive, 2-4 hours handling stren.. |
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| Pot Life | 60.0 - 1440 min | 60.0 - 1440 min | Average value: 630 min Grade Count:5 |
| Overview of materials for Silicone, RTV, Adhesive/Sealant Grade This property data is a summary of similar materials in the MatWeb database for the category "Silicone, RTV, Adhesive/Sealant Grade". Each property range of values reported is minimum and maximum va.. |
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| Pot Life | 60.0 min @Temperature 25.0 °C |
60.0 min @Temperature 77.0 °F |
4 fl. Oz.; ASTM D2471 |
| Fibre Glast 2000 / 2060 System 2000 Epoxy System 2000 Epoxy Resin is a low viscosity, light amber laminating resin that is designed for fabricating parts and other demanding structural applications. Use this system to maximize the physical .. |
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| Pot Life | 60.0 min @Temperature 23.9 °C |
60.0 min @Temperature 75.0 °F |
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| ITW Devcon Metal Repair Wear Resistant Epoxy (WR-2), Dark Grey Information provided by ITW Devcon |
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| Pot Life | 60.0 min @Temperature 25.0 °C |
60.0 min @Temperature 77.0 °F |
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| Momentive Performance Materials RTV21 Pink General Purpose Potting/Encapsulating Compound Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate.. |
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| Pot Life | 60.0 min @Temperature 25.0 °C |
60.0 min @Temperature 77.0 °F |
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| Momentive Performance Materials RTV6156 Clear Potting/Encapsulating Gel Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth.. |
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| Pot Life | 60.0 min @Temperature 25.0 °C |
60.0 min @Temperature 77.0 °F |
2X initial viscosity |
| Tra-Con Tra-Bond 216C05 Information provided by Tra-Con Inc. |
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| Pot Life | 60.0 min @Temperature 25.0 °C |
60.0 min @Temperature 77.0 °F |
100 grams |
| Trelleborg Emerson & Cuming Eccobond® 23 LV General Purpose Catalyst Emerson & Cuming 23 LV Eccobond® General Purpose CatalystExcellent low temperature performance properties, excellent thermal shock/cycle and impact resistance. Good hardener for cryogenic applicati.. |
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| Pot Life | 60.0 min @Temperature 25.0 °C |
60.0 min @Temperature 77.0 °F |
100 grams |
| Cytec (Conap) RN-1200 / EA-87 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Pot Life | 60.0 min @Temperature 25.0 °C |
60.0 min @Temperature 77.0 °F |
100 grams |
| Cytec (Conap) RN-1210 / EA-87 Conapoxy® Resin / Conacure® Hardener Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an.. |
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| Pot Life | 60.0 - 80.0 min @Temperature 25.0 °C |
60.0 - 80.0 min @Temperature 77.0 °F |
1 lbm |
| Cytec EN-2521 (Conap) Potting and Encapsulation Adhesive Polyurethane Potting and Encapsulating SystemsConathane® EN-2500 series polyurethane potting and encapsulating systems from Cytek have varying degrees of worklife, viscosity and hardness for many s.. |
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| Pot Life | 60.0 min @Temperature 23.9 °C |
60.0 min @Temperature 75.0 °F |
|
| Devcon HVAC Repair (Special F) Epoxy General Repair EpoxyComments: Aluminum-filled epoxy adhesive, conveniently packaged in two 6.5 oz. tubes. Bonds to aluminum and other metals, ceramics, wood, concrete or glass. Use as an adhesive .. |
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| Pot Life | <= 60.0 min @Temperature 25.0 °C |
<= 60.0 min @Temperature 77.0 °F |
100 g |
| Armstrong A-2/W Epoxy Adhesive This off-white paste epoxy is a versatile adhesive systems. The choice of one of four recommended Activators (A, E, W or H-20) makes A-2 Adhesive an ideal choice for many applications. A-2 with Ac.. |
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| Pot Life | 60.0 min @Temperature 25.0 °C |
60.0 min @Temperature 77.0 °F |
100 gm mass |
| Aremco Aremco-Bond™ 2220 High Performance Epoxide Ceramic-Filled, High Chemical Resistance, Machinable. For Repairing Deeply-Corroded Parts. |
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| Pot Life | 60.0 min | 60.0 min | 100 grams, uncured |
| Atom Adhesives AA-BOND 2110 Epoxy Adhesive AA-BOND 2110 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and manufacturing applications where long pot-life, good wetting, no.. |
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| Pot Life | 60.0 - 120 min | 60.0 - 120 min | |
| Aremco Ceramacast™ 575-N High Temperature Potting & Casting Material Alumina Fine grain castable for potting and producing small tools. |
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| Pot Life | 60.0 - 120 min | 60.0 - 120 min | |
| Aremco Ceramacast™ 673-N High Temperature Potting & Casting Material Silicon Carbide Single-part castable ceramic exhibiting high strength and thermal conductivity. |
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| Pot Life | 60.0 min | 60.0 min | uncured |
| Atom Adhesives AA-BOND 428 Epoxy Adhesive AA-BOND 428 is a two part, heat-resistant and low exotherm, epoxy adhesive formulation. It is a 100% solid epoxy adhesive, with superior chemical resistance and shear strength. AA-BOND 428 contains .. |
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| Pot Life | 60.0 min | 60.0 min | uncured |
| Atom Adhesives AA-DUCT 902 Epoxy Adhesive and Coating AA-DUCT 902 is an epoxy adhesive and coating formulation based on pure silver. This versatile silver formulation offers the maximum continuity of conductivity with an electrical resistivity value of.. |
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| Pot Life | 60.0 min | 60.0 min | uncured |
| Atom Adhesives AA-DUCT 903 Epoxy Adhesive AA-DUCT 903 is an epoxy adhesive and coating formulation based on Nickel. This epoxy nickel formulation offers the maximum continuity of conductivity with an electrical resistivity value of less tha.. |
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| Pot Life | 60.0 min | 60.0 min | uncured |
| Atom Adhesives AA-BOND 2170 Epoxy Adhesive AA-BOND 2170 is a flexible thixotropic bonding adhesive designed for bonding all types of plastics including nylon, PVC, polyethylene, acrylic, lexan, kapton or almost any thermoplastic substrate. A.. |
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| Pot Life | 60.0 min | 60.0 min | uncured |
| Atom Adhesives AA-SUPERTHERM 195 Epoxy Adhesive AA-SUPERTHERM 195 is a two component, thermally conductive epoxy system recommended for staking transistors, diodes, resistors, integrated circuits and other heat sensitive components to printed cir.. |
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| Pot Life | 60.0 min @Temperature 25.0 °C |
60.0 min @Temperature 77.0 °F |
100 gm mass |
| Aremco Aremco-Bond™ 2320 High Performance Epoxide Toughened, Unfilled, Fast-Setting, BPA Free, 2:1, High Peel & Shear Strength |
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| Pot Life | 60.0 min @Temperature 25.0 °C |
60.0 min @Temperature 77.0 °F |
4 fl. Oz.; ASTM D2471 |
| Fibre Glast RAE 2426 / 2177 Epoxy
(discontinued **) Information provided by Fibre Glast Developments Corporation. |
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