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- Polymer Property : Pot Life = 240 min
Polymer Property : Pot Life = 240 min Product List
Processing PropertiesTips: 30 items are displayed at most. For the rest of the results, please contact customer service.
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Pot Life | 240 min | 240 min | |
| Resin Technology Group 408 Oxy-Bond™ Electrically Conductive Epoxy Adhesive Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to ma.. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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| Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive 100 parts resin to 6 parts hardener.TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gol.. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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| Lord Adhesives Aeroglaze® 9741 Epoxy Primer/Tie-Coat Aeroglaze® 9741 is a two-part epoxy primer designed for use on aluminum, metal, and prepared composite surfaces. Aeroglaze 9741 primer/tie-coat is applied to scuff-sanded urethane top coats and e.. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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| Lord Adhesives Aeroglaze® 9743 Epoxy Primer/Tie-Coat Aeroglaze® 9743 is a two-part epoxy primer designed for use on aluminum, metal, and prepared composite surfaces. Aeroglaze 9743 primer/tie-coat can be applied to scuff-sanded urethane top coats a.. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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| Lord Adhesives Aeroglaze® 9744 Epoxy Primer/Tie-Coat Aeroglaze® 9744 is a two-part epoxy primer designed for use on aluminum, metal, and prepared composite surfaces. Aeroglaze 9744 primer/tie-coat is applied to scuff-sanded urethane top coats and e.. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
50% relative humidity |
| Lord Adhesives Aeroglaze® K3425 Sandable Primer/Surfacer For application on epoxy graphite or other plastic substrates or over a suitable primer on metal.Limitations - Aeroglaze® K3425 primer/surfacer contains no inhibiting pigments and is not suitable.. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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| Momentive Performance Materials RTV615 Clear General Purpose Potting/Encapsulating Compound Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth.. |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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| Momentive Performance Materials RTV656 Clear Extreme Low Temperature Potting/Encapsulating Compound Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth.. |
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| Pot Life | 240 min | 240 min | |
| Tra-Con Tra-Bond F123 Color Keyed High Temperature Epoxy Adhesive TRA-BOND F123 is a fast cure, low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating sin.. |
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| Pot Life | 240 min | 240 min | |
| Tra-Con Tra-Cast FS407 Low Viscosity High Temperature Epoxy Casting System TRA-CAST FS407 is a low viscosity, solvent-free epoxy casting system recommended for rigid industrial laminating, electrical potting and transformer or coil embedding applications that require the e.. |
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| Pot Life | 240 min | 240 min | |
| Tra-Con Tra-Duct 2958 Snap Cure Conductive Silver Epoxy Adhesive TRA-DUCT 2958 is a two-part, smooth paste of specially refined and processed epoxy and silver components, recommended for electronic, microelectronic and die-attach bonding and sealing applications .. |
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| Pot Life | >= 240 min @Temperature 25.0 °C |
>= 240 min @Temperature 77.0 °F |
100 grams |
| Trelleborg Emerson & Cuming Eccobond® 11 Heat Cure Catalyst Emerson & Cuming 11 Eccobond® Heat Cure CatalystGeneral purpose, low viscosity, elevated temperature curing. Long working life. Yields cured coatings with excellent chemical resistance. Subject to .. |
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| Pot Life | 240 min | 240 min | |
| Tra-Con Tra-Bond 526M03 Fast Cure Epoxy Adhesive TRA-BOND 526M03 is a fast cure, high viscosity, two-component epoxy formulation. It develops strong, tough, mechanically stable bonds to a wide variety of fiber optic and optical materials that incl.. |
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| Pot Life | 240 - 360 min @Temperature 25.0 °C |
240 - 360 min @Temperature 77.0 °F |
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| Cytec Conathane® CC-1155 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Pot Life | 240 - 360 min @Temperature 25.0 °C |
240 - 360 min @Temperature 77.0 °F |
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| Cytec Conathane® CC-1195 (Conap) Polyurethane Two-component Dielectric Conformal Coating Dielectric Conformal Coatings for ElectronicsCytec dielectric conformal coatings are the most widely used conformal coatings in industry today for such divergent applications as aircraft avionics, i.. |
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| Pot Life | 240 min | 240 min | |
| Epoxy Technology EPO-TEK® 375 High Temperature Epoxy Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen sy.. |
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| Pot Life | 240 min | 240 min | |
| Epoxy Technology EPO-TEK® EJ2189 Electrically Conductive Epoxy Product Description: EPO-TEK® EJ2189 is an electrically conductive, silver-filled epoxy paste. This two component system is designed for low temperature curing from ambient to 80°C, although othe.. |
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| Pot Life | 240 min | 240 min | |
| Epoxy Technology EPO-TEK® EV2002 Silver-filled, electrically conductive, flexible epoxy Material Description: Silver-filled, electrically conductive, flexible epoxyInformation Provided by Epoxy Technology |
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| Pot Life | 240 min | 240 min | |
| Epoxy Technology EPO-TEK® OD2002 High Temperature Epoxy Material Description: High Tg version of EPO-TEK®353ND with low modulus and good toughness. Replacement for EPO-TEK® 364. Complies with USP Class VI biocompatibility standards.Information Provid.. |
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| Pot Life | 240 min | 240 min | |
| Epoxy Technology EPO-TEK® OE101 Two Component Epoxy Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf.. |
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| Pot Life | 240 min | 240 min | |
| Epoxyset Epoxiohm EO-21M-5 Electrically Conductive Epoxy Adhesive EO-21M-5 is an electrically conductive & thermally conductive, silver filled epoxy adhesive. This two component system is designed to be cured at room temperature or the cure can be accelerated by e.. |
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| Pot Life | 240 min | 240 min | |
| Epoxyset Epoxiohm EO-30M-1 Electrically Conductive Epoxy Adhesive EO-30M-1 is a two part, semi-rigid, silver filled, epoxy adhesive. EO-30M-1 exhibits superior adhesion to a wide variety of substrates including most metals, ceramics, glass and plastics.Information.. |
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| Pot Life | 240 min @Temperature 75.0 °C |
240 min @Temperature 167 °F |
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| ACC EP WQS EPI Engineered Polymers Water Base Quick Set Epoxy EP WQS Water Base Quick Set, “Powered by Reactamine® Technology”, is a two component 60% solids, no VOC, self-leveling modified epoxy. This versatile new generation epoxy displays low blush, fast.. |
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| Pot Life | 240 min @Temperature 24.0 °C |
240 min @Temperature 75.2 °F |
15 lb. mass |
| BCC Products BC 7009-2 Epoxy Casting BC 7009-2 is an iron filled, low-cost mass casting system. Recommended for use in casting a minimum of two inches and a maximum of six inches in non-conductive molds. Thicknesses to nine inches in m.. |
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| Pot Life | >= 240 min @Temperature 23.0 °C |
>= 240 min @Temperature 73.4 °F |
100 g mass |
| Aremco Aremco-Bond™ 2340 High Temperature Epoxide Potting Compound High Temperature, Low Viscosity, Low Expansion, High Glass Transition Temperature & Chemical Resistance |
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| Pot Life | 240 min | 240 min | uncured |
| Atom Adhesives AA-BOND F123BK Epoxy Adhesive AA-BOND F123BK is a low viscosity, two-component epoxy formulation that signals both proper mixing and curing when bonding fiber optic bundles, potting glass fibers, and/or terminating single or mul.. |
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| Pot Life | 240 min | 240 min | 100 g |
| Abatron AboCast 7802-1/AboCure 7804-3 (40 pbw) Epoxy AboCast 7802-1 is a clear resin with low viscosity (600-800 cps.) and a weight of 9.1 lbs/gallon. AboCure 7804-3 a clear, slightly accelerated converter for lower rigidity. It has an HDT of 60°C, v.. |
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| Pot Life | 240 min | 240 min | |
| Aremco Aremco-Bond™ 598 Conductive Epoxy Adhesive
(discontinued **) Electrically and thermally conductive, nickel-filled, single part system. Low viscosity, inorganic coating for applications to 1000 ºF (540 °C). |
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| Pot Life | 240 min @Temperature 25.0 °C |
240 min @Temperature 77.0 °F |
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| Momentive Performance Materials RTV630 Blue General Purpose Potting/Encapsulating Compound Two-part addition cure. Two-part addition cure RTV silicones can be cured very quickly with the use of high heat. Addition cure products have no cure by-products and can be used to unlimited depth.. |
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